RGF1 Vishay Intertechnology, RGF1 Datasheet
RGF1
Manufacturer Part Number
RGF1
Description
Manufacturer
Vishay Intertechnology
Datasheet
1.RGF1.pdf
(2 pages)
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Document Number 88697
08-Feb-02
Maximum Ratings & Thermal Characteristics
Parameter
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Max. full load reverse current, full cycle average T
Typical thermal resistance
Operating junction and storage temperature range
Electrical Characteristics
Parameter
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time at
I
Typical junction capacitance at 4.0V, 1MHz
Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
0.030 (0.76)
Mechanical Data
Case: JEDEC DO-214BA, molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Packaging codes/options:
0.060 (1.52)
F
0.100 (2.54)
0.118 (3.00)
0.040 (1.02)
0.066 (1.68)
= 0.5A, I
19/6.5K per 13” Reel (12mm Tape)
17/1.5K per 7” Reel (12mm Tape)
R
= 1.0A, I
DO-214BA (GF1)
0.167 (4.24)
0.196 (4.98)
0.187 (4.75)
0.226 (5.74)
0.006 (0.152) TYP.
rr
0.0065 (0.17)
= 0.25 A
0.015 (0.38)
Surface Mount Glass Passivated Junction
(1)
Weight: 0.0048 oz, 0.12 g
Glass-plastic encapsulation technique is covered by Patent
3,930,306 and lead forming by Patent No. 5,151,846
No. 3,996,602, brazed-lead assembly by Patent No.
Fast Switching Rectifier
(T
0.094 (2.39)
J
0.114 (2.90)
Dimensions in inches and (millimeters)
T
T
= 25°C unless otherwise noted)
L
A
A
= 120°C
A
= 25°C
= 125°C
= 55°C I
0.098 (2.49)
0.108 (2.74)
Symbol RGF1A RGF1B RGF1D RGF1G RGF1J RGF1K RGF1M Unit
Symbol RGF1A RGF1B RGF1D RGF1G RGF1J RGF1K RGF1M Unit
T
V
V
I
R
R
I
J
V
F(AV)
R(AV)
FSM
,T
RRM
RMS
V
C
I
t
DC
R
rr
F
STG
J
JA
JL
®
RA
Features
• Plastic package has Underwriters Laboratories
• Ideal for surface mount automotive applications
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Capable of meeting environmental standards of MIL-S-19500
• Built-in strain relief • Easy pick and place
• Fast switching for high efficiency
• High temperature soldering guaranteed:
• Complete device submersible temperature of 265°C for
50
35
50
Flammability Classification 94V-0
450°C/5 seconds at terminals.
10 seconds in solder bath
Ratings at 25°C ambient temperature unless otherwise specified.
100
100
RB
70
150
200
140
200
RD
–65 to +175
0.052 MIN.
(1.32 MIN.)
(1.68 MIN.)
0.066 MIN.
Vishay Semiconductors
RGF1A thru RGF1M
formerly General Semiconductor
1.30
400
280
400
100
RG
1.0
5.0
8.5
30
50
80
28
Mounting Pad Layout
Reverse Voltage 50 to 1000V
600
420
600
250
RJ
(5.58) REF
Forward Current 1.0A
0.220
800
560
800
RK
500
(2.38 MAX.)
0.094 MAX.
www.vishay.com
1000
1000
700
RM
°C/W
pF
°C
ns
V
V
V
A
A
V
A
A
1
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RGF1 Summary of contents
Page 1
... Built-in strain relief • Easy pick and place • Fast switching for high efficiency • High temperature soldering guaranteed: 450°C/5 seconds at terminals. • Complete device submersible temperature of 265°C for 10 seconds in solder bath Symbol RGF1A RGF1B RGF1D RGF1G RGF1J RGF1K RGF1M Unit RRM V ...
Page 2
... RGF1A thru RGF1M Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (T = 25°C unless otherwise noted) A Fig. 1 – Forward Current Derating Curve P.C.B. Mounted on 0.2 x 0.2" (5.0 x 5.0mm) Copper Pad Areas 1 0 Resistive or Inductive Load 0 100 110 120 130 140 Lead Temperature ( C) Fig. 3 – ...