74LVX541M Fairchild Semiconductor, 74LVX541M Datasheet - Page 6
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74LVX541M
Manufacturer Part Number
74LVX541M
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
Fairchild Semiconductor
Series
74LVXr
Datasheet
1.74LVX541MTCX.pdf
(6 pages)
Specifications of 74LVX541M
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
4mA, 4mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
LVX
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Maximum Power Dissipation
180 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
8 / 8
Output Type
3-State
Propagation Delay Time
14.9 ns at 2.7 V, 10.5 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVX541MTC
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
74LVX541MX
Manufacturer:
FSC
Quantity:
2 118
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Physical Dimensions
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
inches (millimeters) unless otherwise noted (Continued)
Package Number MTC20
6
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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