IXDN409 IXYS Corporation, IXDN409 Datasheet - Page 3
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IXDN409
Manufacturer Part Number
IXDN409
Description
9 Amp Low-side Ultrafast Mosfet Driver
Manufacturer
IXYS Corporation
Datasheet
1.IXDN409.pdf
(10 pages)
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Pin Description
Figure 2 - Characteristics Test Diagram
Pin Configurations
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures
when handling and assembling this component.
* This pin is used only on the IXDD409, and is N/C on the IXDI409 and IXDN409.
Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
SYMBOL
OUT
GND
VCC
EN *
IN
3
1
2
4
Supply Voltage
GND
V C C
EN *
IN
FUNCTION
Ground
Enable
Output
Input
8 PIN DIP (PI)
SO8 (SI)
IXDD409PI / 409SI / 409YI / 409CI IXDI409PI / 409SI / 409YI / 409CI
IXDN409PI / 409SI / 409YI / 409CI
V
GND
V C C
OUT
OUT
IN
Positive power-supply voltage input. This pin provides power to the
entire chip. The range for this voltage is from 4.5V to 25V.
Input signal-TTL or CMOS compatible.
The system enable pin. This pin, when driven low, disables the chip,
forcing high impedance state to the output (IXDD409 Only).
Driver Output. For application purposes, this pin is connected,
through a resistor, to Gate of a MOSFET/IGBT.
The system ground pin. Internally connected to all circuitry, this pin
provides ground reference for the entire chip. This pin should be
connected to a low noise analog ground plane for optimum
performance.
8
7
6
5
3
DESCRIPTION
2
3
4
5
1
TO220 (CI)
TO263 (YI)
OUT
GND
E N *
Vcc
IN