CP12V6TR80 TA-I TECHNOLOGY CO., LTD, CP12V6TR80 Datasheet - Page 4

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CP12V6TR80

Manufacturer Part Number
CP12V6TR80
Description
Lead Free Thin Film Chip Fuse
Manufacturer
TA-I TECHNOLOGY CO., LTD
Datasheet
6.Temperatuer Derating Curve
7.Reliability Tests
Resistance to solder Heat
6.1 Normal Ambient Temperature: 25℃
6.2 Operating Temperature: -20℃~105℃,whit proper Derating factor as below:
Resistance to Dry Heat
Thermal Shock
Resistance to Solvent
Residual Resistance
Interrupting Ability
Temperature Rise
Carrying capacity
Bending Test
Fusing Time
Solderability
Parameter
Lead Free Thin Film Chip Fuse
on protective coating
No evident damages
10kΩ and more
No mechanical
No mechanical
95% coverage
Requirement
Within 5sec.
and marking
△R< 10 %
No fusing
damages
damages
minimum
<75℃
±20%
±20%
After the fuse is interrupted ,rated voltage applied for
100% of its rated current, Measure of surface
-20℃/ +25℃/+125℃/+25℃ , 10 cycles
TA-I TECHNOLOGY CO., LTD
Distance between holding points: 90mm,
23℃±5℃of Isopropyl alcohol 90second
245℃±5℃, 2±0.5second (Lead Free)
Measure DC resistance after fusing
260℃±5℃,10seconds ±1second
Bending:3mm,1time ,30sec
235℃±5℃, 2±0.5second
200% of its rated current
105℃±5℃,1000 hrs
Rated current ,4hr
Test Method
30sec again
temperature
105
Document No
Issued date
Page
TCP-XXOS001A
2008/12/12
4/8

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