FMGA-461 Interpoint Corp., FMGA-461 Datasheet - Page 5

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FMGA-461

Manufacturer Part Number
FMGA-461
Description
Emi Input Filter
Manufacturer
Interpoint Corp.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FMGA-461/883
Manufacturer:
TI
Quantity:
2 594
Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer
Cover marking is oriented with pin one
at the upper right corner.
Differently colored glass bead around pin one or dimple
in header (bottom or side of case) indicates pin one.
CAUTION
Maximum reflow temperature is 220 C for a
maximum of 30 seconds. SN60, SN62, or SN63
are the recommended types of solder. See below
for Solder Mask instructions.
Hand soldering should not exceed 300 C for 10
seconds per pin.
Materials
Header
Cover
Pins
Case dimensions in inches (mm)
Tolerance
to the numerical dimensions for accuracy.
Solder Mask Notes
1. Pad dimensions are for the solder mask opening. Lead common to
2. Ground pins should be connected to the center pad for improved
3. Center pad should not have a solder mask. Solder, copper, or Au/Ni
4. Solder coat to solder down converter.
5. If less rotation of case is desired, make the pad width 0.020inches
6. Do not exceed 220°C as measured on the body of the converter (top
7. Attach the body of the case to the board with a thermally conductive
F
IGURE
each other can be connected underneath as desired.
grounding.
plate are preferred over solder for adhesive attach.
(0.51 mm). Pad length can be extended 0.010 inches (0.25 mm)
towards the case body and as-desired dimension away from the case
body.
or bottom).
adhesive or SN60, 62, or 63 solder. The adhesive can be electrically
conductive as well. It can be applied as an underfill post solder or
dispensed and cured prior or during solder.
5: C
Kovar/Nickel/Gold
Kovar/Nickel
Kovar/Nickel/Gold,
matched glass seal
unless otherwise specified
configurations.
0.005 (0.13) for three decimal places
0.01 (0.3) for two decimal places
See Figure 6
TOP VIEW
0.880 max
ASE
CASE B
(22.35)
for pin
B M
AXIMUM
1.010 max
(25.65)
D
IMENSIONS
0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
0.200 ( 5.08)
0.100 ( 2.54)
C
Gull wing leads are solder dipped.
Lead dimensions are prior to solder dip.
FMGA EMI Filter: Screening – Standard, ES, or 883
MGH Series: Screening – Standard, ES, or 883
1
ASES
0.135 ref. (3.43)
(0.25)
0.010
1
(0.25)
0.010
Bottom of case to
0.000
bottom of lead
(12.7)
0.010 (0.25)
0.50
TOP VIEW CASE B
(25.40)
1.000
1
2
3
4
5
6
7
8
9
F
F
IGURE
IGURE
1.140 ref. (28.96)
(This view shows
straight leads.)
Differently colored glass bead around pin one or dimple in
header (bottom or side of case) indicates pin one.
Cover marking is oriented with pin one at the upper right corn
Straight Leads
Gull Wing Leads
1.870 ref. (47.50)
(1.78)
0.070
7: C
Option
6: C
0.870 (22.10)
ASE
0.060 (1.52)
ASE
0.075 (1.91)
B S
B
0.055
(1.40)
Seam seal
OLDER
18
17
16
15
14
13
12
11
10
0.08
(2.0)
0.030 (0.76)
0.100 (2.54) 16X
M
0.100 (2.54) 4X
ASK
0.08 (2.0)
0.015
(0.38)
CASE B
0.250 max.
(6.35)
B8-7

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