MT16LSDT6464A Micron Technology, MT16LSDT6464A Datasheet

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MT16LSDT6464A

Manufacturer Part Number
MT16LSDT6464A
Description
SYNCHRONOUS DRAM MODULE
Manufacturer
Micron Technology
Datasheet
www.DataSheet4U.com
SYNCHRONOUS
DRAM MODULE
Features
• PC100- and PC133-compliant
• JEDEC-standard 168-pin, dual in-line memory
• Unbuffered
• 256MB (32 Meg x 64), 512MB (64 Meg x 64)
• Single +3.3V ±0.3V power supply
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can
• Internal SDRAM banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, including Concurrent Auto
• 64ms, 8,192 cycle Auto Refresh cycle
• Self Refresh Mode
• LVTTL-compatible inputs and outputs
• Serial Presence-Detect (SPD)
NOTE:
Table 1:
32,64 Meg x 64 SDRAM DIMMs
SD8_16C32_64x64AG_C.fm - Rev. C 11/02
OPTIONS
• Package
• Operating Temperature Range
• Memory Clock/CAS Latency
1. Consult Micron for availability; Industrial Tempera-
Refresh Count
Device Banks
Device Configuration
Row Addressing
Column Addressing
Module Banks
module (DIMM)
edge of system clock
be changed every clock cycle
Precharge, and Auto Refresh Modes
ture Option available in -133 speed only.
Unbuffered
168-pin DIMM (gold)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
(133 MHz)/CL = 2
(133 MHz)/CL = 3
(100 MHz)/CL = 2
Address Table
4 (BA0, BA1)
8K (A0–A12)
32 Meg x 8
1K (A0–A9)
MODULE
1 (S0,S2)
256MB
8K
1
2 (S0,S2; S1,S3)
MARKING
4 (BA0, BA1)
8K (A0–A12)
1K (A0–A9)
32 Meg x 8
MODULE
512MB
None
8K
-13E
-133
-10E
A
G
I
1
Table 2:
Table 3:
NOTE:
MT8LSDT3264A(I) - 256MB
MT16LSDT6464A(I) - 512MB
For the latest data sheet, please refer to the Micron Web
site:
1. The designators for component and PCB revision
PARTNUMBER
MT8LSDT3264AG-13E_
MT8LSDT3264AG(I)-133_
MT8LSDT3264AG-10E_
MT16LSDT6464AG-13E_
MT16LSDT6464AG(I)-133_
MT16LSDT6464AG-10E_
are the last two characters of each part number.
Consult factory for current revision codes. Example:
MT8LSDT3264AG-133B1.
MARKINGS
Figure 1: 168-Pin DIMM (MO–161)
MODULE
www.micron.com/moduleds
Micron Technology, Inc., reserves the right to change products or specifications without notice.
-13E
-133
-10E
1
Timing parameters
Part Numbers
168-PIN SDRAM DIMMs
256MB / 512MB (x64)
CL -
2 - 2 - 2
2 - 2 - 2
2 - 2 - 2
PC100
Low Profile
t
RCD -
Standard
CONFIGURATION
32 Meg x 64
32 Meg x 64
32 Meg x 64
64 Meg x 64
64 Meg x 64
64 Meg x 64
t
RP
CL -
©2002, Micron Technology Inc.
2 - 2 - 2
3 - 3 - 3
PC133
t
RCD -
NA
BUS SPEED
SYSTEM
133 MHz
133 MHz
100 MHz
133 MHz
133 MHz
100 MHz
t
RP

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MT16LSDT6464A Summary of contents

Page 1

... Device Configuration 32 Meg x 8 Row Addressing 8K (A0–A12) Column Addressing 1K (A0–A9) Module Banks 1 (S0,S2) 32,64 Meg x 64 SDRAM DIMMs SD8_16C32_64x64AG_C.fm - Rev. C 11/02 MT8LSDT3264A(I) - 256MB MT16LSDT6464A(I) - 512MB For the latest data sheet, please refer to the Micron Web site: Table 2: MARKING A G None 1 I Table 3: ...

Page 2

... NC NC 126 A12 147 U10 PIN 84 U17 U18 U19 PIN 85 pin SS Micron Technology, Inc., reserves the right to change products or specifications without notice. 148 V SS 149 DQ53 150 DQ54 151 DQ55 V SS 153 DQ56 154 DQ57 155 DQ58 156 ...

Page 3

... Serial Presence-Detect Data: SDA is a bidirectional pin used to Output transfer addresses and data into and out of the presence- detect portion of the module. 3 256MB / 512MB (x64) 168-PIN SDRAM DIMMs Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2002, Micron Technology Inc. ...

Page 4

... TYPE DESCRIPTION V Supply Power Supply: +3.3V ±0.3V Supply Ground – Not Connected: These pins are not connected on these modules. Micron Technology, Inc., reserves the right to change products or specifications without notice. 4 256MB / 512MB (x64) 168-PIN SDRAM DIMMs ©2002, Micron Technology Inc. ...

Page 5

... DQ58 DQ DQ59 DQ U8 DQ60 DQ DQ61 DQ DQ62 DQ DQ63 CK0 CK2 U8 U9 3.3pF CK1, CK3 10pF SDRAMs = MT48LC32M8A2TG, Commercial Temperature SDRAMs = MT48LC32M8A2TG-75 IT, Industrial Temperature Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2002, Micron Technology Inc. ...

Page 6

... U19 U5 U6 U11 U7 U12 CK3 U8 U13 U9 U14 3.3pF 3.3pF SPD SCL U10 SDA SA0 SA1 SA2 SDRAMs = MT48LC32M8A2TG, Commercial Temperature SDRAMs = MT48LC32M8A2TG-75 IT, Industrial Temperature Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2002, Micron Technology Inc. ...

Page 7

... General Description The MT8LSDT13264A(I) and MT16LSDT6464A(I) are high-speed CMOS, dynamic random-access, 256MB and 512MB memory modules organized in x64 configurations. These modules use internally config- ured quad-bank SDRAMS with a synchronous inter- face (all signals are registered on the positive edge of the clock signals CK0-CK3). ...

Page 8

... M3. The ordering of the accesses within a burst is deter- mined by the burst length, the burst type, and the starting column adress, as shown in Table 7, Burst Def- initions, on page 9. Micron Technology, Inc., reserves the right to change products or specifications without notice. 8 ©2002, Micron Technology Inc. ...

Page 9

... For a burst length of one, A0–A9 select the unique column to be accessed, and Mode Register bit M3 is ignored. For a full-page burst, the full row is selected and A0–A8 select the starting column. Micron Technology, Inc., reserves the right to change products or specifications without notice BURST TYPE = ...

Page 10

... SDRAM DIMMs CAS Latency Table ALLOWABLE OPERATING CLOCK FREQUENCY (MHZ) CAS LATENCY = 2 CAS LATENCY = 3 £ 133 £ 100 £ 100 Micron Technology, Inc., reserves the right to change products or specifications without notice. £ 143 £ 133 NA ©2002, Micron Technology Inc. ...

Page 11

... – – – – L – – – – H Micron Technology, Inc., reserves the right to change products or specifications without notice. 11 ADDR DQ NOTES Bank/Row X 1 Bank/Col X 2 Bank/Col Valid 2 X Active Code ...

Page 12

... SYMBOL DDQ Command and Address Inputs, CKE I I CK, S# DQ, DQMB Micron Technology, Inc., reserves the right to change products or specifications without notice. 12 256MB / 512MB (x64) 168-PIN SDRAM DIMMs MIN MAX UNITS NOTES -0.3 0.8 V -40 40 µ ...

Page 13

... I RFC = RFC (MIN RFC = 7.8125µ Micron Technology, Inc., reserves the right to change products or specifications without notice. 13 256MB / 512MB (x64) MAX -133 -10E UNITS NOTES mA 3, 18,19 320 320 mA 3, 12, 19 18, 19, 22 ...

Page 14

... SYMBOL MIN 13 – Micron Technology, Inc., reserves the right to change products or specifications without notice. 14 MAX UNITS 30.4 pF 17.3 pF 15.2 pF 30 MAX UNITS 60.8 pF 17.3 pF 15.2 pF 30 ©2002, Micron Technology Inc. ...

Page 15

... CLK 1 CLK + + 7.5ns 7ns Micron Technology, Inc., reserves the right to change products or specifications without notice. UNITS NOTES ...

Page 16

... DPL BDL CDL RDL MRD ROH( ROH(2) Micron Technology, Inc., reserves the right to change products or specifications without notice. 16 -10E UNITS NOTES ...

Page 17

... Micron Technology, Inc., reserves the right to change products or specifications without notice 7.5ns for - + 2V for a pulse under- ...

Page 18

... Figure 8: Definition of Start and Stop SCL SDA DATA STABLE 18 256MB / 512MB (x64) 168-PIN SDRAM DIMMs START BIT 8 9 Acknowledge Micron Technology, Inc., reserves the right to change products or specifications without notice. STOP BIT ©2002, Micron Technology Inc. ...

Page 19

... – 0 – – – 30 CCS Write – 3 Read – 1 Micron Technology, Inc., reserves the right to change products or specifications without notice UNITS µA µA µA mA ©2002, Micron Technology Inc. ...

Page 20

... SCL t SU:DAT t SU:STA t SU:STO t WRC t WRC) is the time from a valid stop condition of a write sequence to the end of Micron Technology, Inc., reserves the right to change products or specifications without notice. 20 256MB / 512MB (x64) 168-PIN SDRAM DIMMs t SU:STO t BUF UNDEFINED MIN MAX UNITS NOTES ...

Page 21

... RRD 15ns (-133) 20ns (-10E) t 15ns (-13E) RCD 20ns (-133/-10E) 45ns (-13E) t RAS (See note 1) 44ns (133) 50ns (-10E) 21 256MB / 512MB (x64) 168-PIN SDRAM DIMMs ENTRY MT8LSDT3264A(I) MT16LSDT6464A(I) 128 80 256 08 SDRAM LVTTL ...

Page 22

... MICRON 0 100 MHz (-13E/ -133/-10E RP. Actual device spec. value is 37ns. Micron Technology, Inc., reserves the right to change products or specifications without notice. 22 256MB / 512MB (x64) 168-PIN SDRAM DIMMs MT8LSDT3264A(I) MT16LSDT6464A( ...

Page 23

... PIN 84 (PIN 168 ON BACKSIDE) U10 1.131 (28.73) 1.119 (28.42) .700 (17.78) TYP .128 (3.25) (2X) .118 (3.00) .050 (1.27) .039 (1.00) TYP TYP PIN 84 (PIN 168 ON BACKSIDE) Micron Technology, Inc., reserves the right to change products or specifications without notice. .125 (3.18) MAX .054 (1.37) .046 (1.17) .125 (3.18) MAX .054 (1.37) .046 (1.17) ©2002, Micron Technology Inc. ...

Page 24

... All dimensions in inches (millimeters) 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc. 32,64 Meg x 64 SDRAM DIMMs SD8_16C32_64x64AG_C.fm - Rev. C 11/02 ...

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