FMM5829X Eudyna Devices, Inc., FMM5829X Datasheet - Page 11

• Manufacturer Part Number: FMM5829X
• Description: K-Band Power Amplifier MMIC
• Manufacturer: Eudyna Devices, Inc.

■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
RF-IN
1405
2235
2115
2100
195
120
Ｎｏｔｅ
Ｎｏｔｅ : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2~6).
Ｎｏｔｅ
Ｎｏｔｅ
0
0
0
120
120
VGG1
240
VDD1 VDD2
450
(VGG2)
800
830
(VGG4)
(VGG3)
1170
1170
VDD3
VDD4
1840
1840
11
Chip Size : 4025± ± ± ± 30um x 2235± ± ± ± 30um
Chip Thickness : 60± ± ± ± 20um
Bonding Pad Size :
RF-Pad : 120um x 80um
VGG-Pad : 80um x 80um
VDD-Pad : 100um x 100um
K-Band Power Amplifier MMIC
(VGG5)
(VGG6)
2990
2990
VDD5
VDD6
3430
3430
FMM5829X
3905
3905
4025
4025
RF-OUT
1290
2235
2040
195
0