MC74LCX244DW ON Semiconductor, MC74LCX244DW Datasheet - Page 9
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MC74LCX244DW
Manufacturer Part Number
MC74LCX244DW
Description
IC BUFF/DVR TRI-ST DUAL 20SOIC
Manufacturer
ON Semiconductor
Series
74LCXr
Datasheet
1.MC74LCX244DTR2G.pdf
(10 pages)
Specifications of MC74LCX244DW
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC74LCX244DWR2
Manufacturer:
SIPEX
Quantity:
1 965
Company:
Part Number:
MC74LCX244DWR2G
Manufacturer:
ON Semiconductor
Quantity:
210
e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
11
10
E
A
H
E
A
1
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
CASE 967−01
SOEIAJ−20
ISSUE A
M
_
L
9
E
L
DETAIL P
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
H
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.15
5.10
7.40
0.50
1.10
0.70
---
---
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.25
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.006
0.486
0.201
0.291
0.020
0.043
0.028
MIN
---
---
0
0.050 BSC
INCHES
_
MAX
0.081
0.008
0.020
0.010
0.504
0.215
0.323
0.033
0.059
0.035
0.032
10
_