MC100EL52 ON Semiconductor, MC100EL52 Datasheet - Page 2

• Manufacturer Part Number: MC100EL52
• Description: Differential Data and Clock D Flip-Flop
• Manufacturer: ON Semiconductor

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. MAXIMUM RATINGS
V
V
V
I
T
T
q
q
q
q
T
Symbol
out
A
stg
JA
JC
JA
JC
sol
CC
EE
I
Figure 1. Logic Diagram and Pinout Assignment
CLK
CLK
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Wave Solder
D
D
1
2
3
4
Parameter
D
Pb−Free
Pb
8
7
6
5
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V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
EE
CC
EE
CC
V
Q
Q
V
CC
EE
Condition 1
= 0 V
= 0 V
= 0 V
= 0 V
2
Table 1. TRUTH TABLE
Z = LOW to HIGH Transition
* Pin will default low when left open.
Table 2. PIN DESCRIPTION
D, D
CLK, CLK
Q, Q
V
V
EP
CC
EE
V
V
8 SOIC
8 SOIC
8 SOIC
8 TSSOP
8 TSSOP
8 TSSOP
PIN
I
I
 V
 V
D*
H
L
Condition 2
CC
EE
Exposed pad must be connected
to a sufficient thermal conduit.
Electrically connect to the most
negative supply or leave floating
open.
ECL Data Input
ECL Clock Input
ECL Data Output
Positive Supply
Negative Supply
CLK*
FUNCTION
Z
Z
41 to 44 ± 5%
−65 to +150
−40 to +85
41 to 44
Rating
100
190
130
185
140
265
265
−8
−6
50
8
6
Q
H
L
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
V
V
V
V