MC100LVEP34 ON Semiconductor, MC100LVEP34 Datasheet - Page 11

• Manufacturer Part Number: MC100LVEP34
• Description: Clock Generation Chip
• Manufacturer: ON Semiconductor

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
D
S
S
2X
L/2
C
16
1
0.36
16X
16X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
−V−
0.10 (0.004)
A
REF
G
SOLDERING FOOTPRINT*
M
9
8
PACKAGE DIMENSIONS
1
T
1.26
16X
−U−
U
http://onsemi.com
B
CASE 948F−01
H
S
TSSOP−16
ISSUE B
N
V
J
7.06
S
N
DETAIL E
11
J1
DETAIL E
F
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
0.25 (0.010)
DIMENSIONS: MILLIMETERS
M
K1
K
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
0.65
PITCH
ANSI Y14.5M, 1982.
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
G
M
A
B
C
D
F
H
J
K
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.18
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.28
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.007
0.004
0.004
0.007
0.007
MIN
−−−
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.047
0.006
0.030
0.011
0.008
0.006
0.012
0.010
MAX
8
_