BR35H160FVM-WC ROHM Co. Ltd., BR35H160FVM-WC Datasheet - Page 3

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BR35H160FVM-WC

Manufacturer Part Number
BR35H160FVM-WC
Description
Manufacturer
ROHM Co. Ltd.
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
BR35H160FVM-WCTR
Manufacturer:
ROHM/罗姆
Quantity:
20 000
◇NOTES FOR POWER SUPPLY
◇CAUTIONS ON USE
Vcc
In order to prevent an inadvertent write, the device has the feature of P.O.R. 
After the power is on, the device is in the write disable mode. P.O.R. works only during power up. The noise may force
the device write enable mode with CS=“H”during power ON/OFF. In the case of power up, keep the following
conditions to ensure to make the function of P.O.R.
Please keep CS “H” during power ON/OFF.
The device is an active state during CS is low. The extraordinary function or data collaption may occur because of
noise etc., if power-up is done with CS “L”. In order to prevent above errors from happening, keep CS “H” (=Vcc)
during power ON. (The device does not receive any command during CS is high.)
It may continue at low Vcc by capacitance of Vcc line during power off.
Please keep CS “H” during power off because of the device may make malfunction and inadvertent write.
CS
(1) Absolute maximum ratings
(2) GND electric potential
(3) Heat design
(4) Terminal to terminal shortcircuit and wrong packaging
(5) Strong electromagnetic field
Vcc
GND
Vcc
GND
If the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case
of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it
that conditions exceeding the absolute maximum ratings should not be impressed to LSI.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltages is lower than
that of GND terminal.
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging
may destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal
Use in a strong electromagnetic field may cause malfunction, therefore, evaluated design sufficiently.
and GND owing to foreign matter, LSI may be destructed.
Vcc
0
Fig.3 CS TIMING DURING POWER ON/OFF
Good
Fig.2
Vcc waveform
tOFF
Bad
tR
Vbot
(Good example)
CS follows Vcc. (CS is pull up to Vcc)
(Bad example)
CS is low during power ON/OFF.
Please take more than 10ms between power ON and power OFF,
or the internal circuit is not always reset.
REV. B
◇RECOMMENDED CONDITIONS OF tR, tOFF, Vbot
Below 100ms
Below 10ms
tR
Above 10ms
Above 10ms
tOFF
Below 0.3V
Below 0.2V
Vbot
3/4

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