10EL11 ON Semiconductor, 10EL11 Datasheet
10EL11
Related parts for 10EL11
10EL11 Summary of contents
Page 1
... MC10EL11, MC100EL11 5.0 V ECL 1:2 Differential Fanout Buffer The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. The within-device skew and propagation delay is significantly improved over the E111. The differential inputs of the EL11 employ clamping circuitry to maintain stability under open input conditions ...
Page 2
... Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. MC10EL11, MC100EL11 Characteristics Human Body Model ...
Page 3
... Outputs are terminated through resistor min varies 1:1 with V IHCMR input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V and 1 V. MC10EL11, MC100EL11 −40°C Min ...
Page 4
... Outputs are terminated through resistor to V 13. V min varies 1:1 with V IHCMR input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V and 1 V. MC10EL11, MC100EL11 −40°C Min ...
Page 5
... AC parameters guaranteed. The device has a DC gain of ≈ 40. PP Driver Device Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) MC10EL11, MC100EL11 ...
Page 6
... MC100EL11DT MC100EL11DTG MC100EL11DTR2 MC100EL11DTR2G MC100EL11MNR4 MC100EL11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MC10EL11, MC100EL11 Package SOIC−8 SOIC−8 (Pb−Free) SOIC−8 SOIC−8 (Pb−Free) TSSOP− ...
Page 7
... www.DataSheet4U.com −Y− G −Z− 0.25 (0.010) MC10EL11, MC100EL11 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.25 (0.010 SEATING PLANE 0.10 (0.004 SOLDERING FOOTPRINT* 7.0 0.275 0.6 0.024 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ...
Page 8
... PIN 1 www.DataSheet4U.com IDENT 0.15 (0.006 0.10 (0.004) −T− D SEATING PLANE MC10EL11, MC100EL11 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE REF 0.10 (0.004 L −U− −V− DETAIL E ...
Page 9
... Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com MC10EL11, MC100EL11 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D ...