MACH211SP-10 Advanced Micro Devices, MACH211SP-10 Datasheet - Page 23

• Manufacturer Part Number: MACH211SP-10
• Description: High-Density EE CMOS Programmable Logic
• Manufacturer: Advanced Micro Devices

TYPICAL THERMAL CHARACTERISTICS
Measured at 25 C ambient. These parameters are not tested.
Plastic
The data listed for plastic
heat-flow paths in plastic-encapsulated devices are complex, making the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of
the package. Furthermore,
a constant temperature. Therefore, the measurements can only be used in a similar environment. TQFP thermal measurements
are taken with components on a six-layer printed circuit board.
Parameter
Symbol
jma
ja
jc
jc
Considerations
Thermal impedance, junction to case
Thermal impedance, junction to ambient
Thermal impedance, junction to ambient
with air flow
jc
jc
are for reference only and are not recommended for use in calculating junction temperatures. The
tests on packages are performed in a constant-temperature bath, keeping the package surface at
Parameter Description
MACH211SP-7/10/12/15/20
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
jc
measurement relative to a specific location on the
TQFP
11.3
33.7
32.6
35
32
41
Typ
PLCC
18.5
15.9
13.5
12.8
30.4
4
Unit
C/W
C/W
C/W
C/W
C/W
C/W
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