P0102DN5AA4 ST Microelectronics, P0102DN5AA4 Datasheet - Page 4
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P0102DN5AA4
Manufacturer Part Number
P0102DN5AA4
Description
0.8A SCRs
Manufacturer
ST Microelectronics
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Characteristics
Table 6.
1. S = Copper surface under tab.
4/11
Figure 1.
Figure 3.
Symbol
R
R
R
R
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.1
0.7
0.4
0.3
th(j-a)
th(j-a)
th(j-a)
1.0
0.9
0.8
0.6
0.5
0.2
0.1
0.0
th(j-t)
0.0
P(W)
0
I
T(AV)
= 180°
Junction to case (DC)
Junction to tab (DC)
Junction to ambient (DC)
Junction to ambient (mounted on FR4 with recommended pad layout) SOT23-3L
(A)
0.1
Thermal resistance
Maximum average power
dissipation vs. average on-state
current P010xxA and P010xxN
Average and DC on-state current
vs. lead temperature
P010xxA and P010xxN
25
D.C. (SOT-223)
= 180° (SOT-223)
0.2
D.C. (TO-92)
50
I
T(AV)
T
lead
0.3
(A)
= 180° (TO-92)
(°C)
75
0.4
100
0.5
Parameter
360°
125
0.6
Figure 2.
Figure 4.
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
0.00
I
T(AV)
P(W)
D.C. (TO-92)
S
D.C. (SOT-223)
(1)
= 180°
(A)
0.02
= 5 cm
Maximum average power
dissipation vs. average on-state
current P010xxL
Average and DC on-state current
vs. ambient temperature P010xxA
and P010xxN
25
= 180° (TO-92)
0.04
2
0.06
SOT-223
SOT-223
= 180° (SOT-223)
50
TO-92
TO-92
I
T(AV)
0.08
T
amb
(A)
(°C)
0.10
75
Maximum
0.12
150
400
80
30
60
Device mounted on
FR4 with recomended
pad layout for SOT-223
0.14
100
360°
0.16
P010xx
°C/W
°C/W
°C/W
°C/W
Unit
0.18
125