FP2189-RFID WJ Communications, FP2189-RFID Datasheet - Page 13

• Manufacturer Part Number: FP2189-RFID
• Description: 1 - Watt HFET
• Manufacturer: WJ Communications

FP2189
1 - Watt HFET
Thermal Specifications
1. The thermal resistance is referenced from the hottest
2. This corresponds to the typical drain biasing condition
WJ Communications, Inc
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Junction Temperature, Tjc
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
part of the junction to the ground tab (pin 4).
of +8V, 250 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
FP2189-G (Green / Lead-free SOT-89 Package) Mechanical Information
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Phone 1-800- WJ1-4401 FAX: [phone]
(1)
(2)
Outline Drawing
Land Pattern
Rating
-40 to +85 C
35 C/W
155 C
100
10
1
0
60
e- mail: [e-mail]
Product Information
70
MTTF vs. GND Tab Temperature
Tab Temperature (°C)
80
90
Web site: www.wj.com
100
110
120
Specifications and information are subject to change without notice.
The FP2189-G will be marked with an
“FP21G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 2000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
September 2004