IRF3007 International Rectifier, IRF3007 Datasheet

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IRF3007

Manufacturer Part Number
IRF3007
Description
AUTOMOTIVE MOSFET
Manufacturer
International Rectifier
Datasheet

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Features
Description
Specifically designed for Automotive applications, this
design of HEXFET
lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of
this HEXFET power MOSFET are a 175°C junction
operating temperature, fast switching speed and
improved repetitive avalanche rating. These combine
to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide
variety of other applications.
Absolute Maximum Ratings
Thermal Resistance
Typical Applications
I
I
I
I
P
V
E
E
I
E
T
T
R
R
R
www.irf.com
D
D
D
DM
AR
J
STG
D
GS
AS
AS
AR
@ T
@ T
@ T
JC
CS
JA
@T
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Automotive [Q101] Qualified
42 Volts Automotive Electrical Systems
(6 sigma)
C
C
C
C
= 25°C
= 100°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Single Pulse Avalanche Energy Tested Value‡
Avalanche Current
Repetitive Avalanche Energy†
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
®
Power MOSFETs utilizes the
Parameter
Parameter
AUTOMOTIVE MOSFET
GS
GS
GS
@ 10V (Silicon limited)
@ 10V (See Fig.9)
@ 10V (Package limited)
G
Typ.
0.50
–––
–––
HEXFET
See Fig.12a, 12b, 15, 16
300 (1.6mm from case )
D
S
TO-220AB
Max.
-55 to + 175
1.1 (10)
320
200
± 20
280
946
R
®
1.3
80
56
75
IRF3007
DS(on)
Power MOSFET
Max.
V
0.74
–––
62
DSS
I
D
= 75A
= 0.0126
= 75V
N•m (lbf•in)
Units
Units
W/°C
°C/W
mJ
mJ
°C
W
A
V
A
1

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IRF3007 Summary of contents

Page 1

... Parameter R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA www.irf.com AUTOMOTIVE MOSFET G @ 10V (Silicon limited 10V (See Fig. 10V (Package limited) GS Typ. 0.50 IRF3007 ® HEXFET Power MOSFET 75V DSS R = 0.0126 DS(on 75A D S TO-220AB Max. Units ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 100 BOTTOM 4.5V 10 4.5V 20µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 1000 100 ...

Page 4

0V, C iss = SHORTED 5000 C rss = oss = 4000 Ciss 3000 2000 1000 Coss Crss 0 1 ...

Page 5

LIMITED BY PACKAGE 100 T , Case Temperature C Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.1 0.10 0.05 SINGLE PULSE 0.02 (THERMAL RESPONSE) 0.01 0.01 ...

Page 6

D.U 20V 0.01 Fig 12a. Unclamped Inductive Test Circuit V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Charge ...

Page 7

Duty Cycle = Single Pulse 100 0.01 0.05 10 0.10 1 0.1 1.0E-08 1.0E-07 1.0E-06 Fig 15. Typical Avalanche Current Vs.Pulsewidth 300 T OP Single Pulse BOTT OM 50% Duty Cycle 48A 200 100 0 25 ...

Page 8

D.U.T + ƒ ‚ -  SD Fig 17. Fig 18a. Switching Time Test Circuit V DS 90% 10 Fig 18b. Switching Time Waveforms 8 Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse „ Recovery ...

Page 9

Dimensions are shown in millimeters (inches) 10.54 (.415) 10.29 (.405) 2.87 (.113) 2.62 (.103) 4 15.24 (.600) 14.84 (.584 14.09 (.555) 13.47 (.530) 1.40 (.055) 3X 1.15 (.045) 2.54 (.100) 2X NOTES: 1 DIMENSIONING & TOLERANCING PER ...

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