IRF6633 International Rectifier, IRF6633 Datasheet - Page 3

• Manufacturer Part Number: IRF6633
• Description: DirectFET Power MOSFET
• Manufacturer: International Rectifier


‚
ƒ
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
 Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.05
0.02
0.01
0.20
0.10
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
ƒ
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
„
…
1
Ci= τi/Ri
0.01
T
R
R
C
θ
1
R
1
is measured at
measured with thermocouple incontact with top (Drain) of part.
τ
2
τ
R
2
2
R
2
R
τ
0.1
3
3
R
with
τ
3
3
τ
R
4
J
τ
Typ.
4
R
12.5
4
–––
–––
1.0
4
20
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
τ
5
5
R
τ
-40 to + 150
5
5
1
τ
C
Max.
0.018
τ
footprint full size board with
metalized back and with small
clip heatsink (still air)
ƒ Mounted on minimum
270
2.3
1.5
89
Ri (°C/W)
0.6676
1.0462
1.5611
29.282
25.455
www.DataSheet4U.com
Max.

10
–––
–––
–––
3.0
55
0.000066
0.000896
0.004386
0.68618
32
τi (sec)
IRF6633
100
Units
Units
°C/W
W/°C
°C
W
3