BZX284 Philips Semiconductors, BZX284 Datasheet - Page 6

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BZX284

Manufacturer Part Number
BZX284
Description
Voltage regulator diodes
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board: 11
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.2).
1999 Apr 19
handbook, halfpage
R
SYMBOL
th j-a
Voltage regulator diodes
Dimensions in mm.
Fig.2 SOD110 reflow soldering pattern.
thermal resistance from junction to ambient
1.00
3.00
PARAMETER
1.00
MGC119
1.25
25
1.6 mm.
6
note 1
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.3).
handbook, halfpage
Dimensions in mm.
CONDITIONS
Fig.3 SOD110 wave soldering pattern.
1.10
3.40
BZX284 series
VALUE
1.10
315
Product specification
MGC126
1.25
UNIT
K/W

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