TDA-8170 ST Microelectronics, TDA-8170 Datasheet - Page 6

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TDA-8170

Manufacturer Part Number
TDA-8170
Description
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
Manufacturer
ST Microelectronics
Datasheet
TDA8170
TYPICAL PERFORMANCES
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATT
the heatsink is very simple, a screw a compression
Figure 4 : Mounting Examples
6/7
V
I
t
P
R
T
T
T
V
V
s
fly
s
tot
amb
j max
o
I
7
th o-a
- Current
- Flyback Time
- Supply Voltage
- Power Dissip.
Parameter
- Heatsink
5.9
110 TVC
TM
280
110
0.6
4.2
2.5
2.5
24
60
20
/10 mH
7
package attaching
9.6 /27 mH
110 TVC
22.5
175
110
2.5
2.5
2.5
13
60
20
1
spring (clip) being sufficient. Between the heatsink
and the packageit isbetter to insert a layerof silicon
grease, to optimize the thermal contact ; no electri-
cal isolation is needed between the two surfaces.
15
90 TVC
2.05
125
110
0.7
16
2.5
2.5
/30 mH
25
60
20
Unit
C/W
mA
V
ms
ms
V
W
V
C
C
pp
p

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