TDA2270 ST Microelectronics, TDA2270 Datasheet - Page 6

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TDA2270

Manufacturer Part Number
TDA2270
Description
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
Manufacturer
ST Microelectronics
Datasheet
TDA2270
MOUNTING INSTRUCTIONS
The R
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 4) or to an external
heatsink (fig. 5).
The diagram of figure 6 shows the maximum dissi-
pable power P
the side”l” of two equal square copper areas having
Figure 4 :
Figure 6 :
6/7
th j-amb
Example of P.C. Board Copper Area
which is Used as Heatsink
Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
versus Side ”l”
of the TDA 2270 can be reduced by
tot
and the R
th j-amb
as a function of
a thickness of 35
During soldering the pins temperature must not
exceed 260 C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 5 :
Figure 7 :
External Heatsink Mounting Example
Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
(1.4 mils).

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