MCP1700 Microchip Technology, MCP1700 Datasheet - Page 17

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MCP1700

Manufacturer Part Number
MCP1700
Description
Low Quiescent Current LDO
Manufacturer
Microchip Technology
Datasheet

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© 2007 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
L
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b1
Number of Leads
Pitch
Outside Lead Pitch
Overall Height
Overall Width
Molded Package Width at Base
Molded Package Width at Top
Overall Length
Tab Length
Foot Length
Lead Thickness
Lead 2 Width
Leads 1 & 3 Width
1
e
D1
D
e1
2
b
N
Dimension Limits
b1
E
H
C
Units
E1
D1
e1
b1
N
H
D
A
E
e
L
c
b
1.40
3.94
2.29
2.13
4.39
1.40
0.79
0.35
0.41
0.36
MIN
MILLIMETERS
1.50 BSC
3.00 BSC
3
MAX
1.60
4.25
2.60
2.29
4.60
1.83
1.20
0.44
0.56
0.48
Microchip Technology Drawing C04-029B
E1
MCP1700
DS21826B-page 17

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