MCP1703 Microchip Technology, MCP1703 Datasheet - Page 13
MCP1703
Manufacturer Part Number
MCP1703
Description
250 mA, 16V, Low Quiescent Current
Manufacturer
Microchip Technology
Datasheet
1.MCP1703.pdf
(24 pages)
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6.0
6.1
The MCP1703 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1703 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
The
temperature specified for the MCP1703 is +125
estimate the internal junction temperature of the
MCP1703, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (Rθ
ambient for the SOT-23A pin package is estimated at
336
© 2007 Microchip Technology Inc.
I
50 mA
P
V
V
OUT
Input Voltage Range = 2.7V to 4.8V
LDO
IN(MAX)
OUT(MIN)
°
P
V
1.8V
C/W.
LDO
OUT
maximum
= LDO Pass device internal power dissipation
APPLICATION CIRCUITS &
ISSUES
Typical Application
Power Calculations
Package Type = SOT-23A
V
=
= Maximum input voltage
IN
APPLICATION INPUT CONDITIONS
V
POWER DISSIPATION
IN
JA
= LDO minimum output voltage
(
OUT
). The following equation can be used to
V
). The thermal resistance from junction to
maximum = 4.8V
IN MAX )
C
1 µF Ceramic
(
OUT
typical = 1.8V
Typical Application Circuit.
GND
V
I
continuous
OUT
OUT
MCP1703
)
–
= 50 mA maximum
V
OUT MIN
(
V
IN
operating
)
) I
V
2.7V to 4.8V
×
IN
1 µF Ceramic
OUT MAX )
C
IN
(
junction
°
C
)
.
To
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
EQUATION 6-5:
Where:
Where:
Where:
Where:
P
T
T
T
T
T
P
P
D(MAX)
T
A(MAX)
J(RISE)
J(RISE)
J(MAX)
J(MAX)
TOTAL
TOTAL
AMAX
Rθ
Rθ
Rθ
T
T
JA
JA
JA
A
J
T
J MAX
P
(
= Maximum continuous junction
= Total device power dissipation
= Thermal resistance from junction-
= Maximum ambient temperature
D MAX
= Maximum device power dissipation
= Maximum continuous junction
= Maximum ambient temperature
= Thermal resistance from junction-
= Rise in device junction temperature
= Maximum device power dissipation
= Thermal resistance from junction to
= Junction Temperature
= Rise in device junction temperature
= Ambient temperature
T
(
J RISE
(
temperature
to-ambient
temperature
to-ambient
over the ambient temperature
ambient
over the ambient temperature
)
T
=
)
J
=
P
)
=
TOTAL
=
(
---------------------------------------------------
T
T
J RISE
P
J MAX
(
(
D MAX
(
×
MCP1703
Rθ
Rθ
)
)
+
–
)
JA
JA
×
T
T
A
A MAX
Rθ
+
(
DS22049A-page 13
T
JA
AMAX
)
)