MCP3550-60E/P Microchip Technology, MCP3550-60E/P Datasheet - Page 24
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
MCP3550-60E/P
Manufacturer Part Number
MCP3550-60E/P
Description
15 HZ, 120DB REJECTION AT 50 OR 60 HZ, -40C to +125C, 8-PDIP, TUBE
Manufacturer
Microchip Technology
Datasheet
1.MCP3550-60EP.pdf
(30 pages)
MCP3550/1/3
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21950D-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
φ
A2
A1
E1
L1
N
A
E
D
e
h
L
φ
c
b
α
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
0°
5°
5°
–
MILLMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c