MCP3909 Microchip Technology, MCP3909 Datasheet - Page 34

• Manufacturer Part Number: MCP3909
• Description: Energy Metering IC with SPI Interface and Active Power Pulse Output
• Manufacturer: Microchip Technology

MCP3909
24-Lead Plastic Shrink Small Outline (SS) (SSOP)
DS22025A-page 34
Note:
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed.010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MO-150
Drawing No. C04-132
B
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
See ASME Y14.5M
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
D
φ
B
n
p
A
E
L
c
2
1
MIN
.068
.066
.002
.301
.205
.318
.025
.004
.010
L
0°
φ
D
.026 BSC.
INCHES
NOM
A1
.073
.068
.005
.307
.209
.323
.030
.006
24
4°
–
A
MAX
.078
.070
.008
.311
.212
.328
.037
.015
8°
–
MIN
1.73
1.68
0.05
7.65
5.20
8.07
0.63
0.09
0.25
0°
MILLIMETERS*
0.65 BSC.
Revised 9-14-05
© 2006 Microchip Technology Inc.
NOM
1.86
1.73
0.13
7.80
5.30
8.20
0.75
0.15
4°
24
–
MAX
A2
1.99
1.78
0.21
7.90
5.38
8.33
0.95
0.38
8°
–