TDA8512 Philips Semiconductors, TDA8512 Datasheet - Page 21

• Manufacturer Part Number: TDA8512
• Description: 26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier
• Manufacturer: Philips Semiconductors

Philips Semiconductors
16 SOLDERING
16.1
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
16.2
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
16.4
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2001 Nov 16
DBS, DIP, HDIP, SDIP, SIL
26 W BTL and 2
4
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Suitability of through-hole mount IC packages for dipping and wave soldering methods
13 W SE power amplifier
PACKAGE
13 W SE or
suitable
DIPPING
21
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
16.3
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
SOLDERING METHOD
Manual soldering
suitable
(1)
Preliminary specification
WAVE
TDA8512J
stg(max)
). If the