MCP606 Microchip Technology, MCP606 Datasheet

no-image

MCP606

Manufacturer Part Number
MCP606
Description
2.5V to 5.5V Micropower CMOS Op Amps
Manufacturer
Microchip Technology
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP606-E/OT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP606-I/OT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP606-I/P
Manufacturer:
VISHAY
Quantity:
28 301
Part Number:
MCP606-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP606-I/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP606-I/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP606-I/SN
0
Part Number:
MCP606-I/ST
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP606-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
MCP6061T-E/MNY
Quantity:
9 000
Part Number:
MCP6061T-E/OT
Manufacturer:
ST
Quantity:
1 200
Part Number:
MCP6061T-E/OT
0
Company:
Part Number:
MCP6061T-E/SN
Quantity:
1 000
Part Number:
MCP6062-E/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP6062-E/SN
0
FEATURES
• Low Power I
• Low Offset Voltage: 250 V, max
• Rail-to-Rail Swing at Output
• 80pA, Low Input Bias Current over Temperature
• Specifications rated for 2.5V to 5.5V Supplies
• Unity Gain Stable
• Chip Select Capability with MCP608
• Industrial Temperature range supported
• No Phase Reversal
• Available in Single, Dual, and Quad
APPLICATIONS
• Battery Power Instruments
• High Impedance Applications
• Strain Gauges
• Medical Instruments
• Test Equipment
AVAILABLE TOOLS
• Spice Macromodels (at www.microchip.com)
• FilterLab
© 2000 Microchip Technology Inc.
- Photodiode Pre-amps
- pH probe Buffer Amplifier
- Infrared Detectors
- Precision Integrators
- Charge Amplifier for Piezoelectric
2000 Microchip Technology Inc.
Transducers
TM
DD
Software (at www.microchip.com)
2.5V to 5.5V Micropower CMOS Op Amps
= 25 A, max
MCP606/607/608/609
DESCRIPTION
The MCP606, MCP607, MCP608 and MCP609 from
Microchip Technology, Inc. are unity gain stable, low
offset voltage operational amplifiers capable of preci-
sion low power single supply operation. Performance
characteristics include ultra low offset voltage (250µV,
max), rail-to-rail output swing capability, and low input
bias current (80pA@85C). These features make this
family of amplifiers well suited for single supply preci-
sion, high impedance, battery powered applications.
The single MCP606 is available in standard 8-lead
PDIP, SOIC, and TSSOP packages. Another version of
the single op amp, MCP608 is offered with a Chip
Select option in standard 8-lead PDIP, SOIC, and
TSSOP packages. The dual MCP607 is offered in stan-
dard 8-lead PDIP, SOIC, as well as the TSSOP pack-
age. Finally, the quad MCP609 is offered in 14-lead
PDIP, SOIC and TSSOP packages. All devices are fully
specified from -40 °C to +85 °C with power supplies
from 2.5V to 5.5V.
PACKAGES
V
V
+IN
+IN
NC
NC
-IN
-IN
SS
PDIP, SOIC,TSSOP
SS
PDIP, SOIC,TSSOP
1
1
2
3
4
2
3
4
MCP606
MCP608
+
+
-
-
8
7
6
5
8
7
6
5
NC
V
OUT
NC
CS
V
OUT
NC
DD
DD
OUTA
+INA
OUTA
OUT1
V
+INA
+INB
-IN
-INA
-INB
SS
V
PDIP, SOIC,TSSOP
PDIP, SOIC,TSSOP
DD
1
2
3
4
1
2
3
4
5
6
7
MCP607
MCP609
-
-
-
A
A
B
DS11177B-page 1
+
+
+
+ -
+ -
+
B
C
D
-
10
14
13
12
11
8
7
6
5
9
8
OUTD
-IND
+IND
V
+INC
-INC
OUTC
V
OUT
-INB
+INB
SS
DD

Related parts for MCP606

MCP606 Summary of contents

Page 1

... These features make this family of amplifiers well suited for single supply preci- sion, high impedance, battery powered applications. The single MCP606 is available in standard 8-lead PDIP, SOIC, and TSSOP packages. Another version of the single op amp, MCP608 is offered with a Chip Select option in standard 8-lead PDIP, SOIC, and TSSOP packages ...

Page 2

... MCP606/607/608/609 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* V ..................................................................................7.0V DD All inputs and outputs w.r.t. ............ V –0. Difference Input voltage ....................................... |V Output Short Circuit Current ..................................continuous Current at Input Pin .................................................... +/-2mA Current at Output and Supply Pins .......................... +/-30mA Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-55°C to +125°C Soldering temperature of leads (10 seconds) ............. +300° ...

Page 3

... Operating Temperature Range Storage Temperature Range THERMAL PACKAGE RESISTANCE Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP 2000 Microchip Technology Inc. MCP606/607/608/609 = +2.5V to +5.5V GND SYMBOL MIN. TYP. MAX. GBWP — ...

Page 4

... MCP606/607/608/609 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated FIGURE 2-1: Offset Voltage vs. Number of Occurrences with V FIGURE 2-2: Offset Voltage vs. Number of Occurrences with V FIGURE 2-3: Quiescent Current vs. Power Supply Voltage vs. Temperature DS11177B-page 4 ° and / OUT DD FIGURE 2-4: = 5.5V DD FIGURE 2-5: = 2.5V DD FIGURE 2-6: = GND SS Offset Voltage Drift vs ...

Page 5

... A FIGURE 2-7: Normalized Offset Voltage vs. Temperature FIGURE 2-8: Open Loop Gain, Phase Margin vs. Frequency FIGURE 2-9: Phase Margin, Gain Bandwidth, vs. Load Resistance 2000 Microchip Technology Inc. MCP606/607/608/609 ° and / OUT DD FIGURE 2-10: Input Offset Voltage vs. FIGURE 2-11: Phase Margin, Gain Bandwidth FIGURE 2-12: Input Voltage Noise Density vs ...

Page 6

... MCP606/607/608/609 Note: Unless otherwise indicated FIGURE 2-13: Input Bias Current, Input Offset Current vs. Temperature FIGURE 2-14: DC Open Loop Gain vs. Output Load Resistance FIGURE 2-15: Common-Mode Rejection Ratio, Power Supply Rejection Ratio vs. Frequency DS11177B-page 6 ° and / OUT DD FIGURE 2-16: Input Bias Current, Input Offset FIGURE 2-17: DC Open Loop Gain vs ...

Page 7

... Note: Unless otherwise indicated FIGURE 2-19: Low Level and High Level Output Swing vs. Load Resistance FIGURE 2-20: Maximum Full Scale Output Voltage Swing vs. Frequency FIGURE 2-21: Slew Rate vs. Temperature 2000 Microchip Technology Inc. MCP606/607/608/609 ° and / OUT DD FIGURE 2-22: Low Level and High Level output FIGURE 2-23: Low Level and High level FIGURE 2-24: Output Short Circuit Current vs ...

Page 8

... MCP606/607/608/609 Note: Unless otherwise indicated FIGURE 2-25: Large Signal Non-inverting Signal Pulse Response FIGURE 2-26: Small Signal Non-inverting Pulse Response FIGURE 2-27: Channel to Channel Separation (MCP607 and MCP609 only) DS11177B-page 8 ° and / OUT DD FIGURE 2-28: Large Signal Inverting Signal ...

Page 9

... Note: Unless otherwise indicated FIGURE 2-31: CS hysteresis (MCP608 only) 2000 Microchip Technology Inc. MCP606/607/608/609 ° and / OUT DD = GND SS DS11177B-page 9 ...

Page 10

... V 2. This output swing performance is shown in Figure 3-1, where the output of an MCP606 is configured in a gain of +2V/V and overdriven with a 4kHz triangle wave. In this figure, the degradation of the output swing linearity is clearly illustrated. This degradation occurs after the ...

Page 11

... The Phase versus Capacitive Load of the MCP60X amplifier is shown in Figure 3-4. In this figure, it can be seen that the amplifier has a phase margin above 40 while driving capacitance loads up to 220pF. 2000 Microchip Technology Inc. MCP606/607/608/609 - 1.1V ...

Page 12

... OFF 18.7 A (typ) 18.7 A (typ) Guard Ring FIGURE 3-7: MCP606, the A-amplifier of the MCP607 or the MCP608 Board Layout Circuit examples of ring implementations are shown in Figure 3-8. In Figure 3-8A, B and C, the guard ring is biased to the common-mode voltage of the amplifier. This type of guard ring is most effective for applications ...

Page 13

... Microchip Technology Inc. MCP606/607/608/609 3.5.2 SIGNAL COUPLING The input pins of the MCP606/607/608/609 amplifiers have a high impedance providing an opportunity for noise injection, if layout issues are not considered. These high impedance input terminals are sensitive to injected currents. This can occur if the trace from a high impedance input is next to a trace that has fast chang- ing voltages, such as a digital or clock signal ...

Page 14

... Figure 3-10. In this circuit, the cur- rent from the power supply (minus the current required to power the MCP606) flows through a ten ohm resistor from the rest of the circuit in the system. This current is converted to a voltage through the sense resistor and gained by the resistors around the amplifier ...

Page 15

... R 1 3.6.5 PRECISION GAIN WITH GOOD LOAD ISOLATION In Figure 3-14, the low input offset voltage of the 1 MCP606 is used to implement a circuit with a high gain This precision measurement can easily be disrupted by V OUT changing the output current drive of the device that is doing the amplification work. Consequently the preci- ...

Page 16

... MCP606/607/608/609 4.0 SPICE MACROMODEL The Spice macromodel for the MCP606, MCP607, MCP608 and MCP609 simulates the typical amplifier performance of offset voltage, DC power supply rejec- tion, input capacitance, DC common mode rejection ratio, open loop gain over frequency, phase margin with no capacitive load, output swing, DC power supply cur- rent, power supply current change with supply voltage, input common mode range and input voltage noise ...

Page 17

... Macromodel for MCP606 (single), MCP607 (dual), MCP608 (single w/CS), and MCP609 (quad The characteristics of the MCP606, MCP607, MCP608, and MCP609 have the same fundamental * performance and behavior. Consequently, this single op amp macromodel supports all four * devices. However, the chip select function of the MCP608 is not modeled. ...

Page 18

... MCP606/607/608/609 VST 58 4 1.6 GCMP2 23 4 POLY( 0;0 -0.5E-3 0.5E-3 *Input errors (vos, en, psr) ERR 64 1 poly(2) (67,4) (3, 4) -229.9e-6 1 23e-6 *Second Stage, pole at 0.183Hz 8.2144e9 110e-12 VSOM 3 24 4.784 VSOP 25 4 -3.98 DSOM DSOP *HCM 23 3 VCMP ...

Page 19

... For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2000 Microchip Technology Inc. MCP606/607/608/609 Example MCP606 XXXXXNNN 0025 Example MCP606 XXX0025 NNN Example XXXX 0025 NNN DS11177B-page 19 ...

Page 20

... For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS11177B-page 20 Example MCP606 XXXXXXXXXXXXXX 0025NNN Example MCP606 0025NNN Example XXXXXX YYWW NNN 2000 Microchip Technology Inc. ...

Page 21

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2000 Microchip Technology Inc. MCP606/607/608/609 ...

Page 22

... MCP606/607/608/609 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width ...

Page 23

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 2000 Microchip Technology Inc. MCP606/607/608/609 Units ...

Page 24

... MCP606/607/608/609 14-Lead Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 25

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065 2000 Microchip Technology Inc. MCP606/607/608/609 Units ...

Page 26

... MCP606/607/608/609 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 27

... Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2000 Microchip Technology Inc. MCP606/607/608/609 Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. ...

Page 28

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: MCP606/607/608/609 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this data sheet easy to follow? If not, why? 4 ...

Page 29

... NOTES: 2000 Microchip Technology Inc. MCP606/607/608/609 DS11177B-page 29 ...

Page 30

... MCP606/607/608/609 NOTES: DS11177B-page 30 2000 Microchip Technology Inc. ...

Page 31

... SL = Plastic SOIC (150 mil Body), 14-lead ST = Plastic TSSOP, 8-lead and 14-lead I = –40°C to +85°C MCP606 = Single Operational Amplifier MCP606T = Single Operational Amplifier (Tape and Reel-SOIC/TSSOP) MCP607 = Dual Operational Amplifier MCP607T = Dual Operational Amplifier (Tape and Reel-SOIC/TSSOP) MCP608 = Single Operational Amplifier w/CS Function ...

Page 32

... Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. ...

Related keywords