TDA8927 Philips Semiconductors, TDA8927 Datasheet - Page 34

• Manufacturer Part Number: TDA8927
• Description: Power stage 2 x 80 W class-D audio amplifier
• Manufacturer: Philips Semiconductors

Philips Semiconductors
17.4
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Dec 11
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
Power stage 2
audio amplifier
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
Suitability of IC packages for wave, reflow and dipping soldering methods
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
80 W class-D
(4)
, SO, SOJ
PACKAGE
34
suitable
not suitable
not suitable
suitable
not recommended
not recommended
(2)
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
suitable
suitable
suitable
suitable
suitable
REFLOW
Objective specification
TDA8927
(1)
DIPPING
suitable