NCP1422 ON Semiconductor, NCP1422 Datasheet - Page 13

• Manufacturer Part Number: NCP1422
• Description: Sync-Rect PFM Step-Up DC-DC Converter
• Manufacturer: ON Semiconductor

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
*For additional information on our Pb−Free strategy and soldering
(A3)
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
10X
A1
DETAIL A
A
B
E
2.1746
0.3008
E2
A
10X
DFN10, 3 x 3mm, 0.5mm Pitch
PACKAGE DIMENSIONS
C
SOLDERING FOOTPRINT*
SEATING
PLANE
http://onsemi.com
L1
MOLD CMPD
CASE 485C−01
NCP1422
ISSUE A
Bottom View
A1
2.6016
(Optional)
DETAIL A
13
(Optional)
Side View
DETAIL B
EDGE OF PACKAGE
É É É É É É
DIMENSIONS: MILLIMETERS
0.5000 PITCH
1.8508
EXPOSED Cu
3.3048
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
b
D
E
e
K
L
MILLIMETERS
0.80
0.00
0.18
2.45
1.75
0.35
0.00
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03