NCP2890 ON, NCP2890 Datasheet

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NCP2890

Manufacturer Part Number
NCP2890
Description
1.0 Watt Audio Power Amplifier
Manufacturer
ON
Datasheet

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NCP2890
1.0 Watt Audio Power
Amplifier
communication device applications such as mobile phone
applications. The NCP2890 is capable of delivering 1.0 W of
continuous average power to an 8.0 W BTL load from a 5.0 V power
supply, and 320 mW to a 4.0 W BTL load from a 2.6 V power supply.
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
noise that would otherwise occur during turn−on and turn−off
transitions.
controlled gain (with resistors), as well as an externally controlled
turn−on and turn−off times (with the bypass capacitor).
battery, saving the use of an LDO.
Tin−Lead and Lead−Free versions) and a Micro8t package.
Features
Typical Applications
November, 2004 − Rev. 8
The NCP2890 is an audio power amplifier designed for portable
The NCP2890 provides high quality audio while requiring few
The NCP2890 contains circuitry to prevent from “pop and click”
For maximum flexibility, the NCP2890 provides an externally
Due to its excellent PSRR, it can be directly connected to the
This device is available in a 9−Pin Flip−Chip CSP (standard
Pb−Free Packages are Available
1.0 W to an 8.0 W BTL Load from a 5.0 V Power Supply
Excellent PSRR: Direct Connection to the Battery
“Pop and Click” Noise Protection Circuit
Ultra Low Current Shutdown Mode
2.2 V−5.5 V Operation
External Gain Configuration Capability
External Turn−on and Turn−off Time Configuration Capability
Up to 1.0 nF Capacitive Load Driving Capability
Thermal Overload Protection Circuitry
Portable Electronic Devices
PDAs
Wireless Phones
Semiconductor Components Industries, LLC, 2004
1
SHUTDOWN
8
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
BYPASS
1
1
INM
INP
ORDERING INFORMATION
x
A, R
Y
WW, W = Work Week
BYPASS
9−Pin Flip−Chip CSP
VM_P
INM
PIN CONNECTIONS
B1
A1
C1
9−Pin Flip−Chip CSP
http://onsemi.com
1
2
3
4
CASE 499E
FC SUFFIX
CASE 846A
DM SUFFIX
= Specific Device Code,
= Assembly Location
= Year
(Top View)
(Top View)
Micro8
G or H
Micro8
OUTA
OUTB SHUTDOWN
VM
A2
C2
B2
Publication Order Number:
INP
A3
B3
C3
V
8
7
6
5
A3
p
DIAGRAMS
A1
MARKING
1
8
OUTB
VM
V
OUTA
AYWW
NCP2890/D
p
MAx
RYW
MAB
C1

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NCP2890 Summary of contents

Page 1

... The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1 continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 320 4.0 W BTL load from a 2.6 V power supply. ...

Page 2

... Ci Ri − 390 BYPASS bypass SHUTDOWN VIH VIL Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input This device contains 671 active transistors and 1899 MOS gates. NCP2890 − OUTA + ...

Page 3

... Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor R and to the input resistor R f OUTA Negative output of the NCP2890. Connected to the load and to the feedback resistor Rf. INP Positive input of the first amplifier, receives the common mode voltage. VM_P Power Analog Ground ...

Page 4

... This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply. 8. See page 11 for a theoretical approach of these parameters. 9. For this parameter, the Min/Max values are given for information. NCP2890 between − +85 C (Unless otherwise noted). A Symbol ...

Page 5

... FREQUENCY (Hz) Figure 3. THD + N versus Frequency 2 100 mW out 0.1 0.01 0.001 10 100 1000 FREQUENCY (Hz) Figure 5. THD + N versus Frequency NCP2890 Typical Performance Characteristics 1 0.1 0.01 0.001 10,000 100,000 10 Figure 2. THD + N versus Frequency 1 0.1 0.01 0.001 10,000 100,000 10 Figure 4. THD + N versus Frequency ...

Page 6

... 1300 THD+N = 10% 1100 900 700 500 300 100 2.0 2.5 3.0 3.5 POWER SUPPLY (V) Figure 11. Output Power versus Power Supply NCP2890 Typical Performance Characteristics 10 1 0.1 0.01 0.001 400 500 600 0 Figure 8. THD + N versus Power Out kHz 1 A 0.1 0.01 300 ...

Page 7

... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 17 SRR NCP2890 Typical Performance Characteristics −25 −30 −35 −40 −45 −50 −55 −60 −65 10,000 100,000 −30 −35 −40 −45 −50 −55 − ...

Page 8

... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 23 SRR p NCP2890 Typical Performance Characteristics −30 −35 −40 −45 −50 −55 −60 −65 −70 −75 10 10,000 100,000 = −30 −35 −40 −45 −50 −55 − ...

Page 9

... DC OUTPUT VOLTAGE (V) Figure 27 Output Voltage SRR Figure 29. Turning On Time − V NCP2890 0 −10 −20 −30 −40 −50 −60 −70 −80 10,000 100,000 −5 −4 − Figure 26 − ...

Page 10

... P = 633 mW Dmax 100 for 100 T , AMBIENT TEMPERATURE ( C) A Figure 35. Power Derating − 9−Pin Flip−Chip CSP NCP2890 0.3 0.25 0.2 0.15 0.1 0. 1.2 0 0.1 Figure 32. Power Dissipation versus Output 0.4 0.35 R 0.3 0.25 0.2 0.15 0.1 0.05 0 0.3 0.4 0 0.05 0.1 Figure 34. Power Dissipation versus Output ...

Page 11

... Detailed Description The NCP2890 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 W load (V = 2.6 V) and 1.0 W rms output p power to 8.0 W load (V = 5.0 V). p The structure of the NCP2890 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain− ...

Page 12

... R Bypass Capacitor Selection (Cby) The bypass capacitor Cby provides half−supply filtering and determines how fast the NCP2890 turns on. This capacitor is a critical component to minimize the turn−on pop. A 1.0 mF bypass capacitor value = < 0.39 mF) should produce clickless and popless ...

Page 13

... NCP2890 Silkscreen Layer Top Layer Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com Bottom Layer 13 ...

Page 14

... Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. NCP2890 PCB Footprint Ref ...

Page 15

... NCP2890 PACKAGE DIMENSIONS 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499E−01 ISSUE O −A− 0.10 C −B− 0.10 C 0.05 C −C− A2 SEATING A1 PLANE 0. 0.03 C SOLDERING FOOTPRINT* 0.265 0.01 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ...

Page 16

... C −−− 1.10 −−− 0.043 D 0.25 0.40 0.010 0.016 G 0.65 BSC 0.026 BSC H 0.05 0.15 0.002 0.006 J 0.13 0.23 0.005 0.009 K 4.75 5.05 0.187 0.199 L 0.40 0.70 0.016 0.028 5.28 0.208 mm inches ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP2890/D ...

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