NCP563 ON Semiconductor, NCP563 Datasheet - Page 7

• Manufacturer Part Number: NCP563
• Description: (NCP562 / NCP563) AC-DC Offline Switching Controllers/Regulators
• Manufacturer: ON Semiconductor

series are shown in Figure 1 and Figure 2.
Input Decoupling (C1)
recommended and should be connected close to the NCP562
package. Higher values and lower ESR will improve the
overall line transient response.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Output Decoupling (C2)
do not require any specific Equivalent Series Resistance
(ESR) or a minimum output current. Capacitors exhibiting
ESRs ranging from a few m up to 10
used. The minimum decoupling value is 0.1 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,
or C3216X7R1C105K
Enable Operation (NCP562 ONLY)
and turn off the regulator when pulled low. These limits of
threshold are covered in the electrical specification section
of this data sheet. If the enable is not used, then the pin
should be connected to V
Hints
When the impedance of these lines is high, there is a chance
to pick up noise or cause the regulator to malfunction.
A typical application circuit for the NCP562 and NCP563
A 1.0 mF capacitor either ceramic or tantalum is
The NCP562 and NCP563 are very stable regulators and
The enable pin will turn on the regulator when pulled high
Please be sure the Vin and Gnd lines are sufficiently wide.
in
.
can thus safely be
APPLICATIONS INFORMATION
NCP562, NCP563
http://onsemi.com
7
capacitor, as close as possible to the circuit, and make leads
as short as possible.
Thermal
might become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material and also the
ambient temperature effect the rate of temperature rise for
the part. This is stating that when the devices have good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
given by:
maximum 125 C, then the NCP562 and NCP563 can
dissipate up to 250 mW @ 25 C.
calculated from the following equation:
current from the data sheet is 2.5 mA. For an NCP562 or
NCP563 (3.0 V), the maximum input voltage will then be
6.0 V.
Place external components, especially the output
As power across the NCP562 and NCP563 increases, it
The maximum dissipation the package can handle is
If junction temperature is not allowed above the
The power dissipated by the NCP562 and NCP563 can be
or
If an 80 mA output current is needed then the ground
P tot + [ V in * I gnd (I out ) ] ) [ V in * V out ] * I out
V inMAX +
PD +
T J(max) *T A
P tot ) V out * I out
I gnd ) I out
R qJA