MAS9178 MAS, MAS9178 Datasheet - Page 2

• Manufacturer Part Number: MAS9178
• Description: Stand-alone am Receiver ic
• Manufacturer: MAS

PAD LAYOUT
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in the center of VDD pad
Pad Identification
Power Supply Voltage
Quartz Filter Output for Crystal
Quartz Filter Input for Crystal and External
Compensation Capacitor
Quartz Filter Output for External
Compensation Capacitor
AGC Capacitor
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down Input
Positive Receiver Input
Negative Receiver Input
Power Supply Ground
Notes:
1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced
2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
3) PDN = VSS means receiver on; PDN = VDD means receiver off
(modulated)
-
-
-
-
the output is a current source/sink with |I
at power down the output is pulled to VSS (pull down switch)
Internal pull-up with current < 1 A which is switched off at power down
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
DIE size = 1.91 x 1.78 mm; PAD size = 100 x 100 m except for VSS PAD size 104 x 112 m
www.DataSheet4U.com
VSS RFM RFP PDN AON
VDD QOP QI QOM AGC
1906 µm
9178
A1
Name
QOM
QOP
VDD
AGC
OUT
DEC
AON
PDN
RFM
RFP
VSS
OUT
QI
| > 5 A
X-coordinate
1146 m
1389 m
1389 m
1146 m
OUT
306 m
549 m
866 m
829 m
586 m
269 m
DEC
16 m
0 m
1778 µm
Y-coordinate
1428 m
1428 m
1428 m
1428 m
1428 m
1407 m
19 m
19 m
19 m
19 m
19 m
0 m
22 Apr, 2003
DA9178.000
Note
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2
3
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