MAS9275 MAS, MAS9275 Datasheet - Page 2

• Manufacturer Part Number: MAS9275
• Description: IC FOR 10.00 - 36.00 MHz VCXO
• Manufacturer: MAS

PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATION CONDITIONS
Note 1: It is recommend to connect a 1 nF capacitor to the VDD pin (either in a module or in an end
application).
Note 2: Crystal Load Capacitance is typically 8.2 pF, when V
Pin Description
Crystal/Varactor Oscillator Input
Voltage Control Input
Power Supply Ground
Buffer Output
Power Supply Voltage
Tri State
Crystal Oscillator Output
Parameter
Supply Voltage
Supply Current
Operating Temperature
Voltage Control Line
Impedance
Crystal Pulling Sensitivity
Crystal Load Capacitance
Parameter
Supply Voltage
Input Pin Voltage
Power Dissipation
Storage Temperature
ESD Rating
Symbol
Symbol
Vc
V
T
V
I
P
C
DD
S
V
T
DD
OP
DD
IMP
MAX
L
SS
ST
-
V
MAS9275A1
MAS9275B2
MAS9275B3
MAS9275C2
MAS9275C3
MAS9275C4
Symbol
C
VSS
OUT
VDD
= 1.65 V
VDD = 2.8 V
MAS9275A,
Conditions
VC
PD
X1
MAS9275B
X2
Conditions
HBM
x-coordinate
C
= 2.5 V.
1029
209
600
425
841
379
197
V
Min
SS
-40
2.5
Min
-0.3
-55
-0.3
10.5
10.5
10.5
V
Typ
2.8
2.3
30
10
10
1
8
DD
y-coordinate
Max
100
120
6.0
2
+ 0.3
1030
1016
1028
1030
161
165
175
Max
+85
5.5
Unit
mW
kV
o
V
V
19 February 2004
C
ppm/pF
Unit
MΩ
mA
pF
o
V
C
DA9275.007
Note
Note
2 (10)
Note
1)
2)
2)
2)