MAS9283 MAS, MAS9283 Datasheet - Page 2

• Manufacturer Part Number: MAS9283
• Description: IC FOR 10.00 - 56.00 MHz VCXO
• Manufacturer: MAS

PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location. However, the distances between pads are
accurate.
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATION CONDITIONS
Note 1: It is recommended to connect a 1 nF capacitor between the V
Note 2: For 3.3 V versions MAS9283AA-AE, MAS9283AN-AR.
Note 3: Value at 15MHz. At 40MHz I
Note 4: MAS9283AG – AL has a typical crystal load capacitance of 8.5 pF when V
has a typical crystal load capacitance of 9 pF when V
Pin Description
Crystal Oscillator Output
Voltage Control Input
Power Supply Ground
Crystal/Varactor Oscillator Input
Output Buffer Power Down Control
Power Supply Voltage
Buffer Output
Parameter
Supply Voltage
Supply Current
Operating Temperature
Voltage Control Line
Impedance
Crystal Pulling Sensitivity
Crystal Load Capacitance
Parameter
Supply Voltage
Input Pin Voltage
Power Dissipation (max)
Storage Temperature
ESD Rating
Symbol
V
Z
Symbol
VC,LINE
DD
V
T
I
DD
C
P
DD
S
T
DD
OP
MAX
L
- V
ST
is typically 5.8 mA.
SS
For 3.3 V versions
Symbol
For 3.3 V / 5.0 V
OUT
V
V
Conditions
VC
PD
V
V
X2
X1
Conditions
DD
SS
C
versions
DD
= 1.65 V
HBM
C
= 2.8 V
= 2.5 V.
x-coordinate
V
186
372
543
149
330
500
919
Min
SS
2.5
2.5
-40
Min
-0.3
-55
DD
-0.3
and V
V
Typ
SS
3.3
3.3
3.2
30
10
1
DD
Max
pins.
100
150
5.5
C
2
+ 0.3
= 2.5 V. MAS9283AT – AX
y-coordinate
Max
+85
5.3
4.0
142
142
142
920
920
920
920
Unit
mW
kV
o
V
V
C
ppm/pF
Unit
M
mA
o
pF
V
C
13 July 2006
DA9283.006
Note
2 (14)
Note
1, 2)
1)
3)
4)