MASW-003100-1192 Tyco Electronics, MASW-003100-1192 Datasheet - Page 6

• Manufacturer Part Number: MASW-003100-1192
• Description: (MASW-00x100-119x) Broadband Monolithic Silicon PIN Diode Switches
• Manufacturer: Tyco Electronics

MASW-001100-1190, MASW-002100-1191, MASW-003100-1192
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150
adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as short as possible.
Mounting
The HMIC switches have TiPtAu back metal. They can be die mounted with a gold-tin eutectic solder preform or
conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment: An 80/20 gold-tin eutectic solder preform is recommended with a work surface
temperature of 255
should be 290
seconds. No more than three seconds should be required for attachment. Solders containing tin should not be
used.
Epoxy Die Attachment: Surface of assembly should be preheated to 125-150
should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy
per manufacturer’s schedule.
6
North America: Tel. [phone]
Monolithic Pin Diode Switches
Notes:
Specification Subject to Change Without Notice
______________________________________________________________________________ M/A-COM, Inc.
1.
Fax [phone]
2. Hatched areas indicate wire bonding pads
o
Topside metallization is gold 2.5µm thick typical. Backside metallization is gold, 1.0µm thick typical.
C. The chip should not be exposed to temperatures greater than 320
o
C and a tool tip temperature of 265
o
C and a force of 18 to 22 grams should be used. Ultrasonic energy should be
þ
Chip Outline Drawings
Asia/Pacific:
MASW-001100-1190
.
Tel. [phone]
Fax [phone]
o
C. When hot gas is applied, the tool tip temperature
1, 2
DIM
G
A
B
C
D
E
H
F
o
C. A minimum amount of epoxy
o
þ
C for more than 20
0.014
0.025
0.004
MIN.
0.008 REF
0.004 REF
0.003 REF
0.003 REF
0.020 REF
INCHES
Europe: Tel. [phone]
MAX.
0.018
0.029
0.006
Fax [phone]
MIN.
0.35
0.64
0.10
0.20 REF
0.10 REF
0.08 REF
0.08 REF
0.52 REF
MM
Rev 2.0
MAX.
0.45
0.74
0.15