ADP2102-EVAL Analog Devices, ADP2102-EVAL Datasheet - Page 3

• Manufacturer Part Number: ADP2102-EVAL
• Description: 600mA 3MHz Synchronous Step-Down DC-DC Converter
• Manufacturer: Analog Devices

Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
AVIN,EN,MODE,FB/OUT to AGND
LX to PGND
PVIN to PGND
PGND to AGND
AVIN to PVIN
Operating Ambient Temperature Range
Operating Junction Temperature
Storage Temperature Range
Soldering Conditions
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified all other voltages
referenced to GND.
In applications where high power dissipation and poor thermal resistance
are present, the maximum ambient temperature may have to be de-rated.
Maximum ambient temperature (T
operating junction temperature (T
dissipation of the device (P
resistance of the part/package in the application (θ
equation: T
A(MAX)
= T
J(MAXOP)
– (θ
D(MAX)
JA
), and the junction-to-ambient thermal
x P
J(MAXOP)
A(MAX)
D(MAX)
) is dependent on the maximum
).
) = 125°C), the maximum power
−0.3V to +(V
Rating
−0.3V to +6V
−0.3V to +6V
−0.3V to 0.3V
-0.3V to 0.3V
−40°C to +85°C
125°C
−65°C to +150°C
JEDEC J-STD-020
JA
), using the following
IN
+ 0.3 V)
1
Rev. PrA| Page 3 of 7
THERMAL RESISTANCE
Table 3. Thermal Resistance
Package Type
8-Lead LFCSP
Maximum Power Dissipation
1
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to the PCB.
ESD CAUTION
Junction-to-ambient thermal resistance (θ
modeling and calculation using a 4-layer board. The junction-to-ambient
thermal resistance is application and board-layout dependent. In
applications where high maximum power dissipation exists, attention to
thermal board design is required. The value of θ
PCB material, layout, and environmental conditions. For more information,
please refer to Application Note AN-772: A Design and Manufacturing Guide
for the Lead Frame Chip Scale Package (LFCSP).
JA
) of the package is based on
θ
54
1
JA
JA
1
can vary depending on
ADP2102
Unit
°C/W
W