LM3410XMY National Semiconductor, LM3410XMY Datasheet - Page 12

• Manufacturer Part Number: LM3410XMY
• Description: LM3410/LM3410Q 525kHz/1.6MHz, Constant Current Boost and SEPIC LED Driver with Internal Compensation; Package: MINI SOIC EXP PAD; No of Pins: 8; Qty per Container: 1000; Container: Reel
• Manufacturer: National Semiconductor

www.national.com
The datasheet values for these symbols are given so that one
might compare the thermal performance of one package
against another. To achieve a comparison between pack-
ages, all other variables must be held constant in the com-
parison (PCB size, copper weight, thermal vias, power
dissipation, V
on the package performance, but it would be a mistake to use
these values to calculate the actual junction temperature in
your application.
IN
, V
OUT
, load current etc). This does shed light
FIGURE 9. Thermal Schematic
12
LM3410 Thermal Models
Heat is dissipated from the LM3410 and other devices. The
external loss elements include the Schottky diode, inductor,
and loads. All loss elements will mutually increase the heat
on the PCB, and therefore increase each other’s tempera-
tures.
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