AN1850 Freescale Semiconductor / Motorola, AN1850 Datasheet - Page 3

• Manufacturer Part Number: AN1850
• Description: Flip-Chip PBGA Package Construction Assembly and Board-Level Reliability
• Manufacturer: Freescale Semiconductor / Motorola

General Package Information
Figure 1 through Figure 4 show a cross-section of each package type.
NOTE:
Figure 1 and Figure 3 do not show the die and are not approximately
proportional. Solder joint pictures are only approximately proportional.
Figure 1. FC PBGA Package Mounted to a Board
Figure 2. FC PBGA Solder Joint
3
Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability