HSC1959SP Hi-Sincerity Mocroelectronics, HSC1959SP Datasheet - Page 3

• Manufacturer Part Number: HSC1959SP
• Description: NPN EPITAXIAL PLANAR TRANSISTOR
• Manufacturer: Hi-Sincerity Mocroelectronics

TO-92SP Dimension
Important Notice:
Head Office And Factory:
Notes:
Material:
HSC1959SP
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]
DIM
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
C
D
A
B
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
0.1450
0.1063
0.5000
Min.
-
Inches
*0.1000
HI-SINCERITY
MICROELECTRONICS CORP.
0.1650
0.1300
A
Max.
3-Lead TO-92SP Plastic Package, HSMC Package Code: SP
-
B
3.70
2.70
12.7
Min.
Millimeters
-
3
2
1
*2.54
Max.
4.20
3.30
-
C
DIM
G
E
F
0.0160
0.0800
Min.
-
Style: Pin 1.Emitter 2.Collector 3.Base
E
Inches
D
*0.0150
0.0240
0.1050
Max.
F
G
Spec. No. : HSP200203
Issued Date : 1998.01.06
Revised Date : 2002.03.04
Page No. : 3/3
HSMC Product Specification
2.03
Min.
0.41
Millimeters
-
*0.38
*: Typical
Max.
0.61
2.67