BTA24-12W06S XP Power Limited, BTA24-12W06S Datasheet - Page 13

• Manufacturer Part Number: BTA24-12W06S
• Description: The Fifth Generation, Ultra Small Size, Isolated Dc-dc Converter
• Manufacturer: XP Power Limited

10. Material of Pin and case
9. Soldering Conditions
11. Vibration / Shock Test
12. Cleaning Condition
Do not vibrate the product during reflow.
Reflow can be done only once. (Please do not mount backside.)
NOTE: Eutectic soldering can be used within condition as above.
Soldering is to be executed under the following conditions.
This product can not be washed whole. No clean solder paste is recommended for this product. When and if
cleaning should be necessary only for DIP type, use IPA and hand-wash only soldered surface by brush cleaning.
After cleaning be sure to dry up before using.
Pin : Phosphor bronze (Ni Foundation Sn Plating)
Case : SPCC (Ni Plating)
Vibration : 10 to 55Hz All Amplitude 1.52mmp-p (2 hours in each of 3 orthogonal axes)
Shock : Acceleration 100G (3 times in each of 3 orthogonal axes, Total 18 times )
1- Soldering Iron (DIP Type, SMD Type)
2- Soldering Dip (DIP type)
3- Reflow (SMD type)
DC-DC Converter
225
Ty2
Ty1
TP
Reflow Temp. Profile
380°C 3sec.
260°C 10sec.
Duration 6ms
The Fifth Generation, Ultra Small Size, Isolated DC-DC Converter
A
Scanning time 15min.
Soldering Dip Time(s)
Solder Sn-3Ag-0.5Cu
A'
B
B'
C
A
A'
B
B'
C
1.0 to 3.0℃/s
Ty1:
Ty2:
Ty1 to Ty2:
1.0 to 4.0℃/s
TP:
Above 225℃:
1.0 to 5.0℃/s
1.5Watt BTA Series
150±10℃
170±10℃
40 to 100s
245℃max.
20 to 40s
BDD20081203
13