BUK9540 Philips Semiconductors, BUK9540 Datasheet
BUK9540
Available stocks
Related parts for BUK9540
BUK9540 Summary of contents
Page 1
... ˚ 100 ˚ ˚ ˚ CONDITIONS - in free air Minimum footprint, FR4 board 1 Product specification BUK9540-100A BUK9640-100A MAX. 100 37 138 175 SYMBOL TO220AB s MIN. MAX. - 100 - 100 ...
Page 2
... Measured from upper edge of drain tab to centre of die(SOT404) Measured from source lead to source bond pad CONDITIONS -dI /dt = 100 - Product specification BUK9540-100A BUK9640-100A MIN. TYP. MAX. UNIT 100 - - 1.5 2 ...
Page 3
... I & Zth/(K/W) 0.01 0.001 120 140 160 180 Product specification BUK9540-100A BUK9640-100A MIN. TYP. MAX ˚C mb RDS(ON)=VDS/ 1us 10us 100us 1ms DC 10ms 100ms 100 10 1 VDS/V Fig.3. Safe operating area ˚C ...
Page 4
... Fig.9. Typical transconductance 2.5 1.5 0 ˚C . Fig.10. Normalised drain-source on-state resistance Product specification BUK9540-100A BUK9640-100A 175 Gate-source voltage, VGS (V) Fig.8. Typical transfer characteristics conditions parameter ...
Page 5
... Ciss Coss Crss 10 100 , Fig.16. Normalised avalanche energy rating. . iss oss rss 5 Product specification BUK9540-100A BUK9640-100A VDS = 14V VDS = 44V f(Q ); conditions parameter VGS = 0 V 175 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 Source-Drain Voltage, VSDS (V) Fig.15. Typical reverse diode current. ...
Page 6
... Avalanche Time, t (ms) AV Fig.18. Maximum permissible repetitive avalanche current(I ) versus avalanche time(t AV inductive loads. December 1999 VDD + - VGS -ID/100 T.U. shunt V DSS DD 25º for unclamped AV 6 Product specification BUK9540-100A BUK9640-100A + RD VDS - RG T.U.T. Fig.19. Switching test circuit. Rev 1.000 VDD ...
Page 7
... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for SOT78 (TO220) envelopes. 3. Epoxy meets UL94 V0 at 1/8". December 1999 10,3 max 3,7 2,8 3,0 13,5 min 1 max (2x) 0,9 max (3x) 2,54 2,54 Fig.20. SOT78 (TO220AB); pin 2 connected to mounting base. 7 Product specification BUK9540-100A BUK9640-100A 4,5 max 1,3 5,9 min 0,6 2,4 Rev 1.000 15,8 max ...
Page 8
... Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18. 3. Epoxy meets UL94 V0 at 1/8". December 1999 E mounting 2 scale max. 0.85 0.64 1.60 10.30 2.90 15.40 11 2.54 0.60 0.46 1.20 9.70 2.10 14.80 REFERENCES IEC JEDEC EIAJ 8 Product specification BUK9540-100A BUK9640-100A 2 -PAK); 3 leads SOT404 base 2.60 2.20 EUROPEAN ISSUE DATE PROJECTION 98-12-14 99-06-25 Rev 1.000 ...
Page 9
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 1999 11.5 9.0 2.0 3.8 5.08 Fig.22. SOT404 : soldering pattern for surface mounting . 9 Product specification BUK9540-100A BUK9640-100A 17.5 Rev 1.000 ...