MCP6051 Microchip Technology Inc., MCP6051 Datasheet - Page 31

• Manufacturer Part Number: MCP6051
• Description: 30 ?a, High Precision Op Amps
• Manufacturer: Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature Range: E
Package:
PART NO.
Device
MCP6051T:
MCP6052:
MCP6052T:
MCP6054:
MCP6054T:
MNY * = Plastic Dual Flat, No Lead, (2x3 TDFN ) 8-lead
SL
SN = Plastic SOIC, (150 mil Body), 8-lead
ST = Plastic TSSOP (4.4mm Body), 14-lead
* Y = Nickel palladium gold manufacturing designator. Only
available on the TDFN package.
MCP6051:
= -40°C to +125°C
= Plastic SOIC (150 mil Body), 14-lead
Temperature
Range
X
Single Op Amp
Single Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Quad Op Amp
Quad Op Amp (Tape and Reel)
(SOIC and TSSOP)
Package
/XX
Examples:
a)
b)
c)
d)
a)
b)
c)
d)
a)
b)
c)
d)
MCP6051-E/SN:
MCP6051T-E/SN:
MCP6051-E/MNY:
MCP6051T-E/MNY:
MCP6052-E/SN:
MCP6052T-E/SN:
MCP6052-E/MNY:
MCP6052T-E/MNY:
MCP6054-E/SL:
MCP6054T-E/SL:
MCP6054-E/ST:
MCP6054T-E/ST:
MCP6051/2/4
.
8LD SOIC package
Tape and Reel,
8LD SOIC package
8LD 2x3 TDFN package
Tape and Reel,
8LD 2x3 TDFN package
8LD SOIC package
Tape and Reel,
8LD SOIC package
8LD 2x3 TDFN package
Tape and Reel
8LD 2x3 TDFN package
14LD SOIC package
Tape and Reel,
14LD SOIC package
14LD TSSOP package
Tape and Reel,
14LD TSSOP package
DS22182A-page 31