SPD30N03 Infineon Technologies, SPD30N03 Datasheet - Page 2

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SPD30N03

Manufacturer Part Number
SPD30N03
Description
SIPMOS Power Transistor
Manufacturer
Infineon Technologies
Datasheet

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Data Sheet
1 current limited by bond wire
2 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
Electrical Characteristics, at T j = 25 ˚C, unless otherwise specified
Parameter
Static Characteristics
Drain- source breakdown voltage
V
Gate threshold voltage, V
I
Zero gate voltage drain current
V
V
Gate-source leakage current
V
Drain-Source on-state resistance
V
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leded
SMD version, device on PCB:
@ min. footprint
@ 6 cm
D
connection. PCB is vertical without blown air.
GS
DS
DS
GS
GS
= 80 µA
= 30 V, V
= 30 V, V
= 0 V, I
= 20 V, V
= 10 V, I
2
cooling area
D
D
= 0.25 mA
GS
GS
DS
= 30 A
= 0 V, T
= 0 V, T
= 0 V
2)
GS
j
j
= 25 ˚C
= 150 ˚C
= V
DS
2
Symbol
V
V
I
I
R
Symbol
R
R
R
DSS
GSS
(BR)DSS
GS(th)
DS(on)
thJC
thJA
thJA
min.
min.
2.1
30
-
-
-
-
-
-
-
Values
Values
0.0085 0.015
0.1
typ.
typ.
10
3
-
-
-
-
-
SPD 30N03
max.
max.
1.25
100
100
100
75
50
1
4
-
Unit
V
µA
nA
Unit
K/W
05.99

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