PHT6N03T Philips Semiconductors, PHT6N03T Datasheet
PHT6N03T
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PHT6N03T Summary of contents
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... T = 100 ˚C amb ˚ ˚C amb ˚ ˚C amb - CONDITIONS Mounted on any PCB Mounted on PCB of Fig.19 1 Product specification PHT6N03T MAX. UNIT ˚C 12 ˚C 5.9 amb 8.3 W 150 ˚ SYMBOL MIN. MAX. ...
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... GS G Resistive load Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad 2 Product specification PHT6N03T MIN. MAX. UNIT - 2 kV MIN. TYP. MAX. UNIT 30 ...
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... 5.9 A; -dI /dt = 100 - CONDITIONS ˚ Product specification PHT6N03T MIN. TYP. MAX. UNIT - - 6 24 0. 115 - MIN. TYP. MAX. UNIT - - 60 mJ Rev 1 ...
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... V GS RDS(ON) / mOhm 7830- 100 100 100 1000 ˚C Fig.6. Typical on-state resistance Product specification PHT6N03T Zth j-amb / (K/W) BUKX83 D = 0.5 0.2 0.1 0.05 0. 1E-05 1E-03 1E-01 1E+ Fig.4. Transient thermal impedance f(t); parameter j-mb ...
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... f 10000 1000 100 100 150 0.1 Fig.12. Typical capacitances f Product specification PHT6N03T BUK759-60 max. typ. min. - 100 150 Fig.10. Gate threshold voltage. = f(T ); conditions mA Sub-Threshold Conduction 2% typ 98 ...
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... Fig.15. Normalised avalanche energy rating DSS 7830-30 VGS 0 1.5 2 Fig.16. Avalanche energy test circuit. W DSS j VGS 0 Fig.17. Switching test circuit. 6 Product specification PHT6N03T 100 120 140 Tmb / f(T ); conditions 5 VDD + L VDS - -ID/100 T.U. RGS shunt 2 ...
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... Philips Semiconductors TrenchMOS transistor Standard level FET MOUNTING INSTRUCTIONS Fig.18. soldering pattern for surface mounting SOT223. November 1997 3.8 min 1.5 min 2.3 6.3 1.5 min (3x) 1.5 min 4.6 7 Product specification PHT6N03T Dimensions in mm. Rev 1.200 ...
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... Philips Semiconductors TrenchMOS transistor Standard level FET PRINTED CIRCUIT BOARD Fig.19. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). November 1997 Product specification PHT6N03T Dimensions in mm. 18 4.5 Rev 1.200 ...
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... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to surface mounting instructions for SOT223 envelope. 3. Epoxy meets UL94 V0 at 1/8". November 1997 6.7 6.3 3.1 0.32 0.24 2.9 0.10 0. max 1.05 2.3 1.8 max 0.85 4.6 Fig.20. SOT223 surface mounting package. 9 Product specification PHT6N03T B 0 7.3 3.7 6.7 3 0.80 0 0.60 (4x) Rev 1.200 M A ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1997 10 Product specification PHT6N03T Rev 1.200 ...