SKY65137 Skyworks Solutions, SKY65137 Datasheet - Page 8

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SKY65137

Manufacturer Part Number
SKY65137
Description
Power Amplifier
Manufacturer
Skyworks Solutions
Datasheet
www.DataSheet4U.com
PRELIMINARY DATA SHEET • SKY65137 WLAN PA
8
Thermal Via Array ∅0.3 mm
Additional vias will improve
All measurements are in millimeters
Note: Thermal vias should be tented and filled with
Component outline
thermal performance.
solder mask: 30 to 35 µm Cu plating recommended.
on 0.6 mm pitch.
6.3
Pin 1
May 4, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 200851D
1.0 Typical
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Pin 20
Component outline
Metallization
6.3
Top View
0.6 Typical
0.2 x 0.2
6.3
0.25 Typical
Figure 12. PCB Layout Footprint For The SKY65137
1.0 Typical
Pin 1
13X 0.75
0.6 Typical
Component outline
Stencil Aperture
13X 0.5
Top View
6.3
Pin 20
Pin 1
1.0 Typical
20X 0.75
Solder Mask Opening
0.875 SQ
20X 0.5
0.5 Typ
Stencil aperture size of 80% to
100% of the module/package
solder mask openings
Top View
6.4
Pin 20
2X 1.94
20X 0.85
2X 1.94
20X 0.6
S1248
6.4

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