SKY77162 Skyworks Solutions, SKY77162 Datasheet - Page 10

• Manufacturer Part Number: SKY77162
• Description: System Smart Power Amplifier Module
• Manufacturer: Skyworks Solutions

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DATA SHEET • SKY77162
10
0.4
0.8 TYP
0.8 TYP
0.6
0.4
May 2, 2006 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200005A
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
STENCIL APERTURE
0.6
Common Ground
METALLIZATION
0.25
APPROACH 1
Pad
TOP VIEW
TOP VIEW
Figure 12. Phone PCB Layout Footprint for 3 x 3 mm, 8-Pad Package – SKY77162
1.2
3.2
3.2
3
3
2.5
Thermal Via Array
Ø0.3 mm on 0.5 mm Pitch
Additional vias will improve
thermal performance.
NOTE: Thermal Vias should
be tented and filled with
solder mask 30–35 µm Cu
plating recommended
Component
Outline
0.8 TYP
0.5
0.8 TYP
0.4
SYSTEM SMART
0.7
SOLDER MASK OPENING
STENCIL APERTURE
0.6
®
PAM FOR CDMA / AMPS (824–849 MHz)
APPROACH 2
TOP VIEW
TOP VIEW
3.2
1.3
1.4
3.3
3
3
ALL DIMENSIONS IN MILLIMETERS
0.75
200005_012
0.15
2.65