SKY77517-21 Skyworks Solutions, SKY77517-21 Datasheet - Page 11

• Manufacturer Part Number: SKY77517-21
• Description: TX-RX iPAC FEM
• Manufacturer: Skyworks Solutions

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SKY77517-21 TX–Rx iPAC™ FEM FOR DUAL-BAND GSM/GPRS
Figure 5. SKY77517–21 FEM Package Pad Configuration – 20-
GND PADS GROUND GRID
Table 5. SKY77517–21 Pad Names and Signal Descriptions
Pad
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
Pad layout as seen from top view looking through the package.
VLOGIC
VRAMP
TX_EN
VBATT
VLOGIC
VRAMP
TX_EN
BS
PCS_RX
GSM_RX
GND
GND
GND
ANT
GND
GND
GND
GND
GND
GSM_IN
NC
PCS_IN
GND
200784A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
BS
Name
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
3
4
2
5
1
6
Pad Leadless (Top View)
20
7
Battery input voltage
Control logic level selection/Standby control
Analog power control voltage input
TX / RX select (mode control)
Band Select (mode control)
PCS Receive RF Output (1930-1990 MHz)
GSM Receive RF Output (869-894 MHz)
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF_IN / RF_OUT to Antenna
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF input 824–849 MHz
No Connect
RF input 1850–1910 MHz
RF and DC Ground
Ground Pads, module underside
GROUND PAD
19
8
18
9
Description
17
10
16
11
15
14
13
12
GND
GND
GND
GND
200494_005
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77517–21 is capable of withstanding an MSL3/250 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 3 °C per second;
maximum temperature should not exceed 250 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 250 °C for more
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Joint Industry Standard J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (see Figure 7). For additional packaging
details, refer to Skyworks Application Note: Tape and Reel
Information – RF Modules, Document Number 101568.
Figure 6. Typical Case Markings
DATA SHEET
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