BU4507DF Philips Semiconductors, BU4507DF Datasheet
BU4507DF
Related parts for BU4507DF
BU4507DF Summary of contents
Page 1
... 1 16kHz 16kHz Csat PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU4507DF TYP. MAX. UNIT - 1500 V - 800 3 1.7 2.1 V 300 400 ...
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... 1 1 500 mA CONDITIONS 0.8 A;(I Csat / Product specification BU4507DF MIN. TYP. MAX 2500 - 22 - MIN. TYP. MAX 1 2.0 800 - - 7.5 13 3.0 0.83 0.92 1. 4.2 5 ...
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... ICsat Lc D.U.T. LB Cfb Rbe Fig.4. Switching times test circuit . hFE Ths = 25 C VCE = 1V Ths = 85 C 0.1 1 Fig.5. High and low DC current gain. hFE BU4507DF/X/Z VCE = 5V Ths = 25 C Ths = 85 C 0.1 1 Fig.6. High and low DC current gain Rev 1.000 ...
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... BU4507DF/X/Z 10 Ths = 25 C Ths = 0.1 0.01 0.001 1.0E- BU4507D ts/tf ICsat = 4 A Ths = 85 C Freq = 16 kHz 2 2 Product specification BU4507DF Normalised Power Derating PD% with heatsink compound 100 120 Ths / C Fig.10. Normalised power dissipation. PD% = 100 25˚C Zth K/W 0.5 0.2 0.1 0.05 0.02 ...
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... Fig.12. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". January 1999 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 5 Product specification BU4507DF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.000 o 45 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1999 6 Product specification BU4507DF Rev 1.000 ...