LT1813 Linear Technology, LT1813 Datasheet - Page 14

• Manufacturer Part Number: LT1813
• Description: (LT1813 / LT1814) Operational Amplifiers
• Manufacturer: Linear Technology

www.DataSheet4U.com
LT1813/LT1814
PACKAGE DESCRIPTIO
14
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.28 ± 0.05
(.0165 ± .0015)
0.42 ± 0.04
GAUGE PLANE
2.38 ±0.05
(.077)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(2 SIDES)
0.18
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
(.010)
0.254
0.675 ±0.05
U
PACKAGE
OUTLINE
DETAIL “A”
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1698)
0° – 6° TYP
0.889 ± 0.127
(.0256)
TOP MARK
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
8-Lead Plastic MSOP
PIN 1
(.021 ± .006)
0.53 ± 0.015
0.200 REF
MS8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
SEATING
PLANE
(1.93 ± .006)
(.118 ± .004)
3.00 ± 0.102
4.90 ± 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
0.65
BSC
1
8
7 6 5
2 3
0.00 – 0.05
4
(.118 ± .004)
3.00 ± 0.102
1.65 ± 0.10
(.206)
(2 SIDES)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 ± .003)
0.13 ± 0.076
MSOP (MS8) 0802
BOTTOM VIEW—EXPOSED PAD
0.28 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 0203
18134fa