MC14174BCPG ON Semiconductor, MC14174BCPG Datasheet - Page 5

• Manufacturer Part Number: MC14174BCPG
• Description: IC FLIP FLOP D HEX CMOS 16DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: D-Type Busr

Specifications of MC14174BCPG

• Function: Reset
• Output Type: Inverted
• Number Of Elements: 1
• Number Of Bits Per Element: 6
• Frequency - Clock: 15.5MHz
• Delay Time - Propagation: 65ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Number Of Circuits: 7
• Logic Family: MC14
• Logic Type: D-Type Flip-Flop
• Polarity: Non-Inverting
• Input Type: Single-Ended
• Propagation Delay Time: 400 ns
• High Level Output Current: - 4.2 mA
• Low Level Output Current: 4.2 mA
• Supply Voltage (max): 18 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 55 C
• Supply Voltage (min): 3 V
• Circuit Type: Low-Power Schottky
• Current, Supply: 600 μA
• Function Type: 6-Channels, D-Type
• Logic Function: Flip-Flop
• Package Type: PDIP-16
• Special Features: Buffered Output
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC14174BCPGOS

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−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
M
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14174B
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
5
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
NOTES:
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
A
B
C
D
G
K
M
P
R
F
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
MAX
MILLIMETERS
18.80
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
MC14174B/D
10
INCHES
_
_
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_