LTC1955 Linear Technology, LTC1955 Datasheet - Page 19

• Manufacturer Part Number: LTC1955
• Description: Dual Smart Card Interface
• Manufacturer: Linear Technology

APPLICATIO S I FOR ATIO
PACKAGE DESCRIPTIO
www.DataSheet4U.com
Figure 8. Setting the Undervoltage Trip Point
5.35 0.05
LTC1955
4.20 0.05
UNDERV
U
3.45 0.05
(4 SIDES)
23
U
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
R1
R2
RECOMMENDED SOLDER PAD LAYOUT
MAIN SUPPLY
V
TRIP
PIN 1
TOP MARK
W
= 1.23V (1 + R1/R2)
U
5.00 0.10
(4 SIDES)
32-Lead Plastic QFN (5mm 5mm)
(Reference LTC DWG # 05-08-1693)
1955 F08
U
0.50 BSC
0.23 0.05
UH Package
0.57 0.05
PACKAGE OUTLINE
0.75 0.05
LTC1955
3.45 0.10
(4-SIDES)
0.00 – 0.05
0.200 REF
CLK X
RST X
I/O X
V
CCX
Figure 9. Additional Components for
Improved Compliance Testing
100
100
100
20pF
1 F
BOTTOM VIEW—EXPOSED PAD
R = 0.115
20pF
TYP
20pF
31
0.50 BSC
0.23 0.05
32
0.1 F
0.40 0.10
LTC1955
1
2
(UH) QFN 0102
C7
C3
C2
C1
sn1955 1955fs
C5
19
SOCKET
SMART
CARD
1955 F09